 | | EP4SGX360NF45C4N | Intel | IC FPGA 920 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 | 936 | |
 | | EP4SGX360NF45I3 | Intel | IC FPGA 920 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 | 463 | |
 | | EP4SGX360NF45I3N | Intel | IC FPGA 920 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 | 350 | |
 | | EP4SGX360NF45I4 | Intel | IC FPGA 920 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1932-BBGA, FCBGA Supplier Device Package: 1932-FBGA, FC (45×45) | 614 | |
 | | EP4SGX360NF45I4G | Intel | IC FPGA 920 I/O 1932FCBGA | FPGAs | 1932-FBGA, FC (45x45) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 | 1,234 | |
 | | EP4SGX360NF45I4N | Intel | IC FPGA 920 I/O 1932FBGA | FPGAs | 1932-FBGA, FC (45x45) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 14144 Number of Logic Elements/Cells: 353600 | 420 | |
 | | EP4SGX530HH35C2 | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 131 | |
 | | EP4SGX530HH35C2ES | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 656 | |
 | | EP4SGX530HH35C2G | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 102 | |
 | | EP4SGX530HH35C2N | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 1,114 | |
 | | EP4SGX530HH35C3 | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 424 | |
 | | EP4SGX530HH35C3ES | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 1,546 | |
 | | EP4SGX530HH35C3G | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 1,203 | |
 | | EP4SGX530HH35C3N | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 636 | |
 | | EP4SGX530HH35C3NES | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 317 | |
 | | EP4SGX530HH35C4 | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 833 | |
 | | EP4SGX530HH35C4N | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 | 1,836 | |
 | | EP4SGX530HH35I3 | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 193 | |
 | | EP4SGX530HH35I3N | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 233 | |
 | | EP4SGX530HH35I4 | Intel | IC FPGA 564 I/O 1152HBGA | FPGAs | 1152-HBGA (42.5x42.5) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 21248 Number of Logic Elements/Cells: 531200 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-HBGA (42.5×42.5) | 195 | |