Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S400-4FT256IXC3S400-4FT256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
173
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,141
XC3S400-4FTG256CXC3S400-4FTG256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
173
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
872
XC3S400-4FTG256IXC3S400-4FTG256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
400000
Number of I/O:
173
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
488
XC3S400-4PQ208CXC3S400-4PQ208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
603
XC3S400-4PQ208IXC3S400-4PQ208IAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
400000
Number of I/O:
141
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
763
XC3S400-4PQG208CXC3S400-4PQG208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
135
XC3S400-4PQG208IXC3S400-4PQG208IAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
920
N/AXC3S400-4TQ144CAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,955
N/AXC3S400-4TQ144IAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,667
XC3S400-4TQG144CXC3S400-4TQG144CAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,139
XC3S400-4TQG144IXC3S400-4TQG144IAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
97
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
332
XC3S400-5FG320CXC3S400-5FG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
221
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
1,421
XC3S400-5FG456CXC3S400-5FG456CAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
264
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,587
XC3S400-5FGG320CXC3S400-5FGG320CAdvanced Micro DevicesIC FPGA 221 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
221
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
336
XC3S400-5FGG456CXC3S400-5FGG456CAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
264
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
375
XC3S400-5FT256CXC3S400-5FT256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
173
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
443
XC3S400-5FTG256CXC3S400-5FTG256CAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
173
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
470
XC3S400-5PQ208CXC3S400-5PQ208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
141
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
791
XC3S400-5PQG208CXC3S400-5PQG208CAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
634
XC3S400-5TQG144CXC3S400-5TQG144CAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
400000
Number of I/O:
97
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
N/A
Total RAM Bits:
294912
523

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