Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AXC5VLX30T-1FFG323IAdvanced Micro DevicesIC FPGA 172 I/O 323FCBGAFPGAs323-FCBGA (19x19)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
172
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Qualification:
N/A
Total RAM Bits:
1327104
1,074
XC5VLX30T-1FFG665CXC5VLX30T-1FFG665CAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1327104
Number of I/O:
360
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
665-BBGA, FCBGA
Supplier Device Package:
665-FCBGA (27×27)
334
XC5VLX30T-1FFG665CESXC5VLX30T-1FFG665CESAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1327104
Number of I/O:
360
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
665-BBGA, FCBGA
Supplier Device Package:
665-FCBGA (27×27)
943
XC5VLX30T-1FFG665IXC5VLX30T-1FFG665IAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Qualification:
N/A
Total RAM Bits:
1327104
473
N/AXC5VLX30T-2FF323IAdvanced Micro DevicesIC FPGA 172 I/O 323FCBGAFPGAs323-FCBGA (19x19)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1327104
Number of I/O:
172
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
323-BBGA, FCBGA
Supplier Device Package:
323-FCBGA (19×19)
283
XC5VLX30T-2FF665IXC5VLX30T-2FF665IAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1327104
Number of I/O:
360
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
665-BBGA, FCBGA
Supplier Device Package:
665-FCBGA (27×27)
935
XC5VLX30T-2FFG665CXC5VLX30T-2FFG665CAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Qualification:
N/A
Total RAM Bits:
1327104
65
XC5VLX30T-2FFG665IXC5VLX30T-2FFG665IAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
360
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Qualification:
N/A
Total RAM Bits:
1327104
474
XC5VLX30T-3FFG665CXC5VLX30T-3FFG665CAdvanced Micro DevicesIC FPGA 360 I/O 665FCBGAFPGAs665-FCBGA (27x27)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2400
Number of Logic Elements/Cells:
30720
Total RAM Bits:
1327104
Number of I/O:
360
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
665-BBGA, FCBGA
Supplier Device Package:
665-FCBGA (27×27)
657
XC5VLX330-1FF1760IXC5VLX330-1FF1760IAdvanced Micro DevicesIC FPGA 1200 I/O 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
10616832
Number of I/O:
1200
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
781
XC5VLX330-1FFG1760CXC5VLX330-1FFG1760CAdvanced Micro DevicesIC FPGA 1200 I/O 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
1200
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Qualification:
N/A
Total RAM Bits:
10616832
1,648
XC5VLX330-1FFG1760IXC5VLX330-1FFG1760IAdvanced Micro DevicesIC FPGA 1200 I/O 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
10616832
Number of I/O:
1200
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
528
XC5VLX330-2FF1760CXC5VLX330-2FF1760CAdvanced Micro DevicesIC FPGA 1200 I/O 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
10616832
Number of I/O:
1200
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
341
XC5VLX330T-1FF1738IXC5VLX330T-1FF1738IAdvanced Micro DevicesIC FPGA 960 I/O 1738FCBGAFPGAs1738-FCBGA (42.5x42.5)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
11943936
Number of I/O:
960
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1738-BBGA, FCBGA
Supplier Device Package:
1738-FCBGA (42.5×42.5)
993
XC5VLX330T-1FFG1738CXC5VLX330T-1FFG1738CAdvanced Micro DevicesIC FPGA 960 I/O 1738FCBGAFPGAs1738-FCBGA (42.5x42.5)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
11943936
Number of I/O:
960
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1738-BBGA, FCBGA
Supplier Device Package:
1738-FCBGA (42.5×42.5)
54
XC5VLX330T-1FFG1738IXC5VLX330T-1FFG1738IAdvanced Micro DevicesIC FPGA 960 I/O 1738FCBGAFPGAs1738-FCBGA (42.5x42.5)0.95V ~ 1.05V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
11943936
Number of I/O:
960
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1738-BBGA, FCBGA
Supplier Device Package:
1738-FCBGA (42.5×42.5)
589
XC5VLX330T-2FFG1738CXC5VLX330T-2FFG1738CAdvanced Micro DevicesIC FPGA 960 I/O 1738FCBGAFPGAs1738-FCBGA (42.5x42.5)0.95V ~ 1.05V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
25920
Number of Logic Elements/Cells:
331776
Total RAM Bits:
11943936
Number of I/O:
960
Voltage – Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1738-BBGA, FCBGA
Supplier Device Package:
1738-FCBGA (42.5×42.5)
1,168
XC5VLX50-1FF1153CXC5VLX50-1FF1153CAdvanced Micro DevicesIC FPGA 560 I/O 1153FCBGAFPGAs1153-FCBGA (35x35)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
560
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Qualification:
N/A
Total RAM Bits:
1769472
860
XC5VLX50-1FF1153IXC5VLX50-1FF1153IAdvanced Micro DevicesIC FPGA 560 I/O 1153FCBGAFPGAs1153-FCBGA (35x35)950 mV - 1.05 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
560
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Qualification:
N/A
Total RAM Bits:
1769472
928
XC5VLX50-1FF324CXC5VLX50-1FF324CAdvanced Micro DevicesIC FPGA 220 I/O 324FCBGAFPGAs324-FCBGA (19x19)950 mV - 1.05 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
220
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Qualification:
N/A
Total RAM Bits:
1769472
154

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