| N/A | | XCV1000E-8FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 27648 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40×40) | 690 | |
| N/A | | XCV100E-6BG352C | Advanced Micro Devices | IC FPGA 196 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 294 | |
| N/A | | XCV100E-6BG352I | Advanced Micro Devices | IC FPGA 196 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,246 | |
 | | XCV100E-6BG352I0773 | Advanced Micro Devices | VIRTEX FPGA, 600CLBS | FPGAs | 352-MBGA (35x35) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,404 | |
| N/A | | XCV100E-6CS144I | Advanced Micro Devices | IC FPGA 94 I/O 144CSBGA | FPGAs | 144-LCSBGA (12x12) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 488 | |
 | | XCV100E-6FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 602 | |
 | | XCV100E-6FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 29 | |
| N/A | | XCV100E-6PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,402 | |
| N/A | | XCV100E-6PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 269 | |
| N/A | | XCV100E-6PQG240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,009 | |
| N/A | | XCV100E-7BG352C | Advanced Micro Devices | IC FPGA 196 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,263 | |
| N/A | | XCV100E-7CS144C | Advanced Micro Devices | IC FPGA 94 I/O 144CSBGA | FPGAs | 144-LCSBGA (12x12) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12×12) | 27 | |
 | | XCV100E-7FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,184 | |
 | | XCV100E-7FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 908 | |
| N/A | | XCV100E-7PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 1,058 | |
| N/A | | XCV100E-7PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 519 | |
 | | XCV100E-8FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 2700 | 544 | |
| N/A | | XCV100E-8PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 2700 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 661 | |
 | | XCV150-4BG256C | Advanced Micro Devices | IC FPGA 180 I/O 256BGA | FPGAs | 256-PBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 3888 | 503 | |
| N/A | | XCV150-4BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 3888 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,373 | |