Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AXCVU9P-2FLGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
448
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
1,158
N/AN/AXCVU9P-2FLGA2577IAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
448
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
758
N/AN/AXCVU9P-2FLGB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Qualification:
N/A
Total RAM Bits:
391168000
997
N/AN/AXCVU9P-2FLGB2104IAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Qualification:
N/A
Total RAM Bits:
391168000
319
N/AN/AXCVU9P-2FLGC2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
416
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
353
N/AN/AXCVU9P-2FLGC2104IAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
416
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
901
N/AN/AXCVU9P-2FSGD2104EAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
676
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
271
N/AN/AXCVU9P-2FSGD2104IAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
676
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Qualification:
N/A
Total RAM Bits:
391168000
54
N/AN/AXCVU9P-3FLGA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAsFLGA2104825 mV - 876 mV0°C – 110°C
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
832
Number of LABs/CLBs:
1182240
Number of Logic Elements/Cells:
2586000
Qualification:
N/A
Total RAM Bits:
362702438
546
N/AN/AXCVU9P-3FLGB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)873 mV - 927 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
702
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Qualification:
N/A
Total RAM Bits:
391168000
1,091
N/AN/AXCVU9P-3FSGD2104EAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
676
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
867
N/AN/AXCVU9P-L2FLGA2104EAdvanced Micro DevicesIC FPGA 832 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
832
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
915
N/AN/AXCVU9P-L2FLGA2577EAdvanced Micro DevicesIC FPGA 448 I/O 2577FCBGAFPGAs2577-FCBGA (52.5x52.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
448
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2577-BBGA, FCBGA
Supplier Device Package:
2577-FCBGA (52.5×52.5)
701
N/AN/AXCVU9P-L2FLGB2104EAdvanced Micro DevicesIC FPGA 702 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
702
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
765
N/AN/AXCVU9P-L2FLGC2104EAdvanced Micro DevicesIC FPGA 416 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
416
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
1,703
N/AN/AXCVU9P-L2FSGD2104EAdvanced Micro DevicesIC FPGA 676 I/O 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
147780
Number of Logic Elements/Cells:
2586150
Total RAM Bits:
391168000
Number of I/O:
676
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
487
XE160FU8F40RAAKXUMA1XE160FU8F40RAAKXUMA1Infineon TechnologiesIC MCU 16/32B 64KB FLASH 38TSSOPMicrocontrollersPG-TSSOP-38-8N/A-40°C ~ 125°C (TA)
Core Processor:
C166SV2
Core Size:
16/32-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSSOP-38-8
Package / Case:
38-TFSOP (0.173″”, 4.40mm Width)
1,273
XE160FU8F66RAAFXUMA1XE160FU8F66RAAFXUMA1Infineon TechnologiesIC MCU 16/32B 64KB FLASH 38TSSOPMicrocontrollersPG-TSSOP-38-8N/A-40°C ~ 85°C (TA)
Core Processor:
C166SV2
Core Size:
16/32-Bit
Speed:
66MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TSSOP-38-8
Package / Case:
38-TFSOP (0.173″”, 4.40mm Width)
1,637
N/AXE161FL12F80VAAFXUMA1Infineon TechnologiesIC MCU 16BIT 96KB FLASH 48VQFNMicrocontrollersPG-VQFN-48-54N/A-40°C ~ 85°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
80MHz
Connectivity:
CANbus, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-VQFN-48-54
Package / Case:
48-VFQFN Exposed Pad
808
N/AXE161FL20F66VAAKXUMA1Infineon TechnologiesIC MCU 16BIT 160KB FLASH 48VQFNMicrocontrollersPG-VQFN-48-54N/A-40°C ~ 125°C (TA)
Core Processor:
C166SV2
Core Size:
16-Bit
Speed:
66MHz
Connectivity:
CANbus, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals:
DMA, I2S, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
160KB (160K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
PG-VQFN-48-54
Package / Case:
48-VFQFN Exposed Pad
800

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