Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
AX1000-2FG484AX1000-2FG484Microchip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
317
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
977
AX1000-2FG484I
AX1000-2FG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
317
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
305
AX1000-2FG676AX1000-2FG676Microchip TechnologyIC FPGA 418 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
418
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
188
AX1000-2FG676IAX1000-2FG676IMicrochip TechnologyIC FPGA 418 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
418
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
1,488
AX1000-2FGG484AX1000-2FGG484Microchip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
317
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
289
AX1000-2FGG484IAX1000-2FGG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
317
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
746
AX1000-2FGG676
AX1000-2FGG676Microchip TechnologyIC FPGA 418 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
418
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
416
AX1000-2FGG676IAX1000-2FGG676IMicrochip TechnologyIC FPGA 418 I/O 676FBGAFPGAs676-FBGA (27x27)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
418
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
906
N/AAX1000-BG729Microchip TechnologyIC FPGA 516 I/O 729BGAFPGAs729-PBGA (35x35)1.425 V - 1.575 V0°C – 70°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
516
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
954
N/A
AX1000-BG729IMicrochip TechnologyIC FPGA 516 I/O 729BGAFPGAs729-PBGA (35x35)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
516
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
729-BBGA
Supplier Device Package:
729-PBGA (35×35)
155
N/A
AX1000-BG729MMicrochip TechnologyIC FPGA 516 I/O 729BGAFPGAs729-PBGA (35x35)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
516
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
729-BBGA
Supplier Device Package:
729-PBGA (35×35)
685
N/A
AX1000-BGG729Microchip TechnologyIC FPGA 516 I/O 729BGAFPGAs729-PBGA (35x35)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
516
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
729-BBGA
Supplier Device Package:
729-PBGA (35×35)
1,288
N/AAX1000-BGG729IMicrochip TechnologyIC FPGA 516 I/O 729BGAFPGAs729-PBGA (35x35)1.425 V - 1.575 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
516
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
1,211
N/A
AX1000-BGG729MMicrochip TechnologyIC FPGA 516 I/O 729BGAFPGAs729-PBGA (35x35)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
516
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
729-BBGA
Supplier Device Package:
729-PBGA (35×35)
421
N/AAX1000-CQ352MMicrochip TechnologyIC FPGA 198 I/O 352CQFPFPGAs352-CQFP (75x75)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
1000000
Number of I/O:
198
Number of LABs/CLBs:
18144
Number of Logic Elements/Cells:
18144
Qualification:
N/A
Total RAM Bits:
165888
1,406
AX1000-FG484
AX1000-FG484Microchip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
317
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,410
AX1000-FG484I
AX1000-FG484IMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
317
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,448
AX1000-FG484M
AX1000-FG484MMicrochip TechnologyIC FPGA 317 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
317
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TA)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
602
AX1000-FG676
AX1000-FG676Microchip TechnologyIC FPGA 418 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V0°C ~ 70°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
418
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
467
AX1000-FG676I
AX1000-FG676IMicrochip TechnologyIC FPGA 418 I/O 676FBGAFPGAs676-FBGA (27x27)1.425V ~ 1.575V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
18144
Total RAM Bits:
165888
Number of I/O:
418
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,400

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