Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP1S30F780C5NEP1S30F780C5NIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
3317184
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
267
EP1S30F780C6EP1S30F780C6IntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
3317184
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,158
EP1S30F780C6NEP1S30F780C6NIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
597
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Qualification:
N/A
Total RAM Bits:
3317184
178
EP1S30F780C7EP1S30F780C7IntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
3317184
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
554
EP1S30F780C7NEP1S30F780C7NIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
3317184
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
763
EP1S30F780C8EP1S30F780C8IntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
597
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Qualification:
N/A
Total RAM Bits:
3317184
234
EP1S30F780C8NEP1S30F780C8NIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
597
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Qualification:
N/A
Total RAM Bits:
3317184
539
EP1S30F780I6EP1S30F780I6IntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
3317184
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
545
EP1S30F780I6NEP1S30F780I6NIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Total RAM Bits:
3317184
Number of I/O:
597
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,217
EP1S40B956C5EP1S40B956C5AlteraIC FPGA 683 I/O 956BGAFPGAs956-BGA (40x40)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Total RAM Bits:
3423744
Number of I/O:
683
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
956-BBGA, FCBGA
Supplier Device Package:
956-BGA (40×40)
918
EP1S40B956C6EP1S40B956C6AlteraIC FPGA 683 I/O 956BGAFPGAs956-BGA (40x40)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Total RAM Bits:
3423744
Number of I/O:
683
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
956-BBGA, FCBGA
Supplier Device Package:
956-BGA (40×40)
653
EP1S40B956C6NEP1S40B956C6NAlteraIC FPGA 683 I/O 956BGAFPGAs956-BGA (40x40)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of I/O:
683
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
956-BBGA
Supplier Device Package:
956-BGA (40×40)
664
EP1S40B956C7EP1S40B956C7AlteraIC FPGA 683 I/O 956BGAFPGAs956-BGA (40x40)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
683
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Qualification:
N/A
Total RAM Bits:
3423744
8
EP1S40B956I6EP1S40B956I6AlteraIC FPGA 683 I/O 956BGAFPGAs956-BGA (40x40)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
683
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Qualification:
N/A
Total RAM Bits:
3423744
234
EP1S40F1020C5EP1S40F1020C5IntelIC FPGA 773 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Total RAM Bits:
3423744
Number of I/O:
773
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
709
EP1S40F1020C5NEP1S40F1020C5NIntelIC FPGA 773 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
773
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Qualification:
N/A
Total RAM Bits:
3423744
705
EP1S40F1020C6EP1S40F1020C6IntelIC FPGA 773 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Total RAM Bits:
3423744
Number of I/O:
773
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
1,644
EP1S40F1020C7EP1S40F1020C7IntelIC FPGA 773 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
773
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Qualification:
N/A
Total RAM Bits:
3423744
951
EP1S40F1020I6EP1S40F1020I6IntelIC FPGA 773 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Total RAM Bits:
3423744
Number of I/O:
773
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
220
EP1S40F1020I6AAEP1S40F1020I6AAIntelIC FPGA 773 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
773
Number of LABs/CLBs:
4125
Number of Logic Elements/Cells:
41250
Qualification:
N/A
Total RAM Bits:
3423744
1,333

Featured Brands

About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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