Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AXAAU10P-1FFVB676QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
1,618
N/A
XAAU10P-1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
469
N/A
XAAU10P-1SBVB484QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)0.825V ~ 0.876V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Total RAM Bits:
3670016
Number of I/O:
204
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
1,583
N/AXAAU10P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
994
N/AXAAU10P-L1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
5500
Number of Logic Elements/Cells:
96250
Qualification:
AEC-Q100
Total RAM Bits:
3670016
418
N/AXAAU15P-1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
35
N/A
XAAU15P-1FFVB676QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Total RAM Bits:
5347738
Number of I/O:
228
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
172
N/AXAAU15P-1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
61
N/AXAAU15P-1SBVB484QAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)825 mV - 876 mV-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
204
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
263
N/AXAAU15P-L1FFVB676IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 676FBGAFPGAs676-FCBGA (27x27)698 mV - 742 mV-40°C – 100°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
228
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Qualification:
AEC-Q100
Total RAM Bits:
5347738
670
N/A
XAAU15P-L1SBVB484IAdvanced Micro DevicesIC FPGA ARTIXUP AUTO 484BGAFPGAs484-FCBGA (19x19)0.698V ~ 0.742V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9720
Number of Logic Elements/Cells:
170100
Total RAM Bits:
5347738
Number of I/O:
204
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-WFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19×19)
1,406
XC2S100-5FG256CXC2S100-5FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
176
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
231
XC2S100-5FG256IXC2S100-5FG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
100000
Number of I/O:
176
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
347
XC2S100-5FG456CXC2S100-5FG456CAdvanced Micro DevicesIC FPGA 196 I/O 456FBGAFPGAs456-FBGA (23x23)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
196
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
962
XC2S100-5FG456IXC2S100-5FG456IAdvanced Micro DevicesIC FPGA 196 I/O 456FBGAFPGAs456-FBGA (23x23)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
100000
Number of I/O:
196
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
1,293
XC2S100-5FGG256CXC2S100-5FGG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
176
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
628
XC2S100-5FGG256I
XC2S100-5FGG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
40960
Number of I/O:
176
Number of Gates:
100000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
628
XC2S100-5PQ208C
XC2S100-5PQ208CAdvanced Micro DevicesIC FPGA 140 I/O 208QFPFPGAs208-PQFP (28x28)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Total RAM Bits:
40960
Number of I/O:
140
Number of Gates:
100000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,716
XC2S100-5PQ208IXC2S100-5PQ208IAdvanced Micro DevicesIC FPGA 140 I/O 208QFPFPGAs208-PQFP (28x28)2.375 V - 2.625 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
100000
Number of I/O:
140
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
596
XC2S100-5PQG208CXC2S100-5PQG208CAdvanced Micro DevicesIC FPGA 140 I/O 208QFPFPGAs208-PQFP (28x28)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
140
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
N/A
Total RAM Bits:
40960
1,144

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About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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