Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
OMAPL137BZKB4OMAPL137BZKB4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Commercial
1,626
OMAPL137BZKBA3OMAPL137BZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
1,156
OMAPL137BZKBD4OMAPL137BZKBD4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
670
OMAPL137BZKBT3OMAPL137BZKBT3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Automotive
284
OMAPL137CZKB3OMAPL137CZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Commercial
689
OMAPL137CZKB4OMAPL137CZKB4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Commercial
1,366
OMAPL137CZKBA3OMAPL137CZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
78
OMAPL137CZKBD4OMAPL137CZKBD4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
1,495
OMAPL137CZKBT3OMAPL137CZKBT3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Automotive
1,151
OMAPL137DZKB3OMAPL137DZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Commercial
721
OMAPL137DZKB4OMAPL137DZKB4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Commercial
1,673
OMAPL137DZKBA3OMAPL137DZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
479
OMAPL137DZKBD4OMAPL137DZKBD4Texas InstrumentsIC MPU OMAP-L1X 456MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
456MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
300
OMAPL137DZKBT3OMAPL137DZKBT3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Automotive
1,346
OMAPL138AZCE3OMAPL138AZCE3Texas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (13x13)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (13×13)
Grade:
Commercial
449
OMAPL138AZCEA3OMAPL138AZCEA3Texas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (13x13)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (13×13)
Grade:
Industrial
331
OMAPL138AZWT3OMAPL138AZWT3Texas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Grade:
Commercial
1,219
OMAPL138AZWTA3OMAPL138AZWTA3Texas InstrumentsDIGITAL SIGNAL PROCESSOR, 16-BITMicroprocessors361-NFBGA (16x16)N/AN/A
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
Display & Interface Controllers:
LCD
SATA:
SATA 3Gbps (1)
707
OMAPL138BGWTMEPOMAPL138BGWTMEPTexas InstrumentsIC MPU OMAP-L1X 345MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A-55°C ~ 125°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
345MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-55°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
856
OMAPL138BZCE3OMAPL138BZCE3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 361NFBGAMicroprocessors361-NFBGA (13x13)1.8V, 3.3V0°C – 90°C
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Mounting Type:
Surface Mount
570

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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