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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | OMAPL137BZKB4 | Texas Instruments | IC MPU OMAP-L1X 456MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 443 | ||
 | OMAPL137BZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 565 | ||
 | OMAPL137BZKBD4 | Texas Instruments | IC MPU OMAP-L1X 456MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 524 | ||
 | OMAPL137BZKBT3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 1,185 | ||
 | OMAPL137CZKB3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 836 | ||
 | OMAPL137CZKB4 | Texas Instruments | IC MPU OMAP-L1X 456MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 757 | ||
 | OMAPL137CZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 353 | ||
 | OMAPL137CZKBD4 | Texas Instruments | IC MPU OMAP-L1X 456MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 976 | ||
 | OMAPL137CZKBT3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 829 | ||
 | OMAPL137DZKB3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 1,707 | ||
 | OMAPL137DZKB4 | Texas Instruments | IC MPU OMAP-L1X 456MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 939 | ||
 | OMAPL137DZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 1,506 | ||
 | OMAPL137DZKBD4 | Texas Instruments | IC MPU OMAP-L1X 456MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 456MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 209 | ||
 | OMAPL137DZKBT3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 713 | ||
 | OMAPL138AZCE3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (13×13) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 1,464 | ||
 | OMAPL138AZCEA3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (13×13) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 1,157 | ||
 | OMAPL138AZWT3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (16×16) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 719 | ||
 | OMAPL138AZWTA3 | Texas Instruments | DIGITAL SIGNAL PROCESSOR, 16-BIT | Microprocessors | N/A | N/A | N/A | N/A | 1,813 | ||
 | OMAPL138BGWTMEP | Texas Instruments | IC MPU OMAP-L1X 345MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | -55°C ~ 125°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 345MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -55°C ~ 125°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (16×16) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 1,613 | ||
 | OMAPL138BZCE3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | 1.8V, 3.3V | 0°C – 90°C | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Mounting Type: Surface Mount | 604 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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