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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCV600-6FG676C
XCV600-6FG676CAdvanced Micro DevicesIC FPGA 444 I/O 676FCBGAFPGAs676-FBGA (27x27)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
98304
Number of I/O:
444
Number of Gates:
661111
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
74
N/A
XCV600-6FG680CAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
98304
Number of I/O:
512
Number of Gates:
661111
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
680-LBGA Exposed Pad
Supplier Device Package:
680-FTEBGA (40×40)
808
N/AXCV600-6HQ240CAdvanced Micro DevicesIC FPGA 166 I/O 240QFPFPGAs240-PQFP (32x32)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
661111
Number of I/O:
166
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
98304
38
N/A
XCV600E-6BG432CAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
294912
Number of I/O:
316
Number of Gates:
985882
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
1,308
N/A
XCV600E-6BG432IAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
294912
Number of I/O:
316
Number of Gates:
985882
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
123
N/AXCV600E-6BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
404
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
417
N/AXCV600E-6BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
985882
Number of I/O:
404
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
1,634
XCV600E-6FG676CXCV600E-6FG676CAdvanced Micro DevicesIC FPGA 444 I/O 676FCBGAFPGAs676-FBGA (27x27)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
444
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
73
XCV600E-6FG676IXCV600E-6FG676IAdvanced Micro DevicesIC FPGA 444 I/O 676FCBGAFPGAs676-FBGA (27x27)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
985882
Number of I/O:
444
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
171
N/AXCV600E-6FG680CAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
512
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
987
XCV600E-6FG900IXCV600E-6FG900IAdvanced Micro DevicesIC FPGA 512 I/O 900FBGAFPGAs900-FBGA (31x31)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
985882
Number of I/O:
512
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
1,060
N/AXCV600E-6HQ240CAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
158
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
1,021
N/AXCV600E-6HQ240IAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
985882
Number of I/O:
158
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
834
N/A
XCV600E-7BG432CAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
294912
Number of I/O:
316
Number of Gates:
985882
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
432-LBGA Exposed Pad, Metal
Supplier Device Package:
432-MBGA (40×40)
348
XCV600E-7BG432C0773XCV600E-7BG432C0773Advanced Micro DevicesFPGA VIRTEX-E FAMILY 186.624K GAFPGAs432-MBGA (40x40)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
316
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
1,096
N/AXCV600E-7BG432IAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
985882
Number of I/O:
316
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
695
N/AXCV600E-7BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
404
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
841
N/A
XCV600E-7BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
294912
Number of I/O:
404
Number of Gates:
985882
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
883
XCV600E-7FG676CXCV600E-7FG676CAdvanced Micro DevicesIC FPGA 444 I/O 676FCBGAFPGAs676-FBGA (27x27)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
444
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
337
XCV600E-7FG676C0773XCV600E-7FG676C0773Advanced Micro DevicesFPGA VIRTEX-E FAMILY 186.624K GAFPGAs676-FBGA (27x27)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
985882
Number of I/O:
444
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
98

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