Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | 5SGSMD3E2H29C1N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 772 | ||
 | N/A | 5SGSMD3E2H29C1WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 105 | |
 | 5SGSMD3E2H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,377 | ||
 | 5SGSMD3E2H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 630 | ||
 | 5SGSMD3E2H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 470 | ||
 | 5SGSMD3E2H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 574 | ||
 | 5SGSMD3E2H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 791 | ||
 | 5SGSMD3E2H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 637 | ||
 | 5SGSMD3E2H29C3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 83 | ||
 | 5SGSMD3E2H29C3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 29 | ||
 | N/A | 5SGSMD3E2H29C3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,099 | |
 | 5SGSMD3E2H29I2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 180 | ||
 | 5SGSMD3E2H29I2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,662 | ||
 | 5SGSMD3E2H29I2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 1,693 | ||
 | 5SGSMD3E2H29I2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 687 | ||
 | 5SGSMD3E2H29I2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,604 | ||
 | 5SGSMD3E2H29I2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 247 | ||
 | N/A | 5SGSMD3E2H29I3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 596 | |
 | 5SGSMD3E2H29I3L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Qualification: N/A Total RAM Bits: 13312000 | 903 | ||
 | N/A | 5SGSMD3E2H29I3LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Total RAM Bits: 13312000 Number of I/O: 360 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 877 |
If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.
Global Sourcing Capabilities
Second Sourcing Solutions
Obsolescence Management
Shortage Mitigation