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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMCIMX6D7CVT08ADNXP SemiconductorsIC MPU I.MX6D 800MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CANbus, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
581
N/AMCIMX6D7CVT08AENXP SemiconductorsIC MPU I.MX6D 800MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
95
N/AMCIMX6D7CZK08ADNXP SemiconductorsIC MPU I.MX6D 800MHZ 569MAPBGAMicroprocessors569-MAPBGA (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
569-LFBGA
Supplier Device Package:
569-MAPBGA (12×12)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
1,222
N/AMCIMX6D7CZK08AENXP SemiconductorsIC MPU I.MX6D 800MHZ 569MAPBGAMicroprocessors569-MAPBGA (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, LVDDR3, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (4)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
569-LFBGA
Supplier Device Package:
569-MAPBGA (12×12)
Additional Interfaces:
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
962
MCIMX6DP4AVT1AAMCIMX6DP4AVT1AANXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
1,685
N/AMCIMX6DP4AVT1AARNXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
937
MCIMX6DP4AVT1ABMCIMX6DP4AVT1ABNXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
523
MCIMX6DP4AVT1ABRMCIMX6DP4AVT1ABRNXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
108
MCIMX6DP4AVT8AAMCIMX6DP4AVT8AANXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
647
N/AMCIMX6DP4AVT8AARNXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
1,319
MCIMX6DP4AVT8ABMCIMX6DP4AVT8ABNXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
520
MCIMX6DP4AVT8ABRMCIMX6DP4AVT8ABRNXP SemiconductorsIC MPU I.MX6DP 852MHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
852MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
1,564
N/AN/AMCIMX6DP5EVT2AANXP SemiconductorsIC MPU I.MX6DP 1.2GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
763
N/AMCIMX6DP5EVT2ABNXP SemiconductorsIC MPU I.MX6DP 1.2GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
27
MCIMX6DP5EYM1AAMCIMX6DP5EYM1AANXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
280
MCIMX6DP5EYM1ABMCIMX6DP5EYM1ABNXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCPBGAMicroprocessors624-FCPBGA (21x21)N/A-20°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-20°C ~ 105°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-LFBGA, FCBGA
Supplier Device Package:
624-FCPBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
1,769
MCIMX6DP6AVT1AAMCIMX6DP6AVT1AANXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
1,374
N/AMCIMX6DP6AVT1AARNXP SemiconductorsIC MPU I.MX6DP 1GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
1,829
MCIMX6DP6AVT1ABMCIMX6DP6AVT1ABNXP SemiconductorsIC MPU I.MX6DP 1.0GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR2, DDR3L, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
131
N/AMCIMX6DP6AVT1ABRNXP SemiconductorsIC MPU I.MX6DP 1GHZ 624FCBGAMicroprocessors624-FCBGA (21x21)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A9
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, Keypad, LCD, LVDS, MIPI/CSI, MIPI/DSI
Ethernet:
10/100/1000Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Mounting Type:
Surface Mount
Package / Case:
624-FBGA, FCBGA
Supplier Device Package:
624-FCBGA (21×21)
Additional Interfaces:
CANbus, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
954

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