| N/A | | AX1000-BGG729M | Microchip Technology | IC FPGA 516 I/O 729BGA | FPGAs | 729-PBGA (35x35) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 729-PBGA (35×35) | 897 | |
| N/A | | AX1000-CQ352M | Microchip Technology | IC FPGA 198 I/O 352CQFP | FPGAs | 352-CQFP (75x75) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 751 | |
 | | AX1000-FG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,257 | |
 | | AX1000-FG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 846 | |
 | | AX1000-FG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 1,994 | |
 | | AX1000-FG676 | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | 0°C ~ 70°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 676-FBGA (27×27) | 957 | |
 | | AX1000-FG676I | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 676-FBGA (27×27) | 817 | |
| N/A | | AX1000-FG676M | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 531 | |
| N/A | | AX1000-FG896M | Microchip Technology | IC FPGA 516 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 896-FBGA (31×31) | 118 | |
 | | AX1000-FGG484 | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 815 | |
 | | AX1000-FGG484I | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 721 | |
 | | AX1000-FGG484M | Microchip Technology | IC FPGA 317 I/O 484FBGA | FPGAs | 484-FPBGA (23x23) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 484-FPBGA (23×23) | 257 | |
 | | AX1000-FGG676 | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | 0°C – 70°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 924 | |
 | | AX1000-FGG676I | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425V ~ 1.575V | -40°C ~ 85°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 676-FBGA (27×27) | 99 | |
 | | AX1000-FGG676M | Microchip Technology | IC FPGA 418 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 1,191 | |
| N/A | | AX1000-FGG896M | Microchip Technology | IC FPGA 516 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 1.425V ~ 1.575V | -55°C ~ 125°C (TA) | Number of LABs/CLBs: 18144 Voltage – Supply: 1.425V ~ 1.575V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TA) Supplier Device Package: 896-FBGA (31×31) | 1,000 | |
| N/A | | AX1000-LG624M | Microchip Technology | IC FPGA 418 I/O 624CLGA | FPGAs | 624-CLGA (32.5x32.5) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 18144 Number of Logic Elements/Cells: 18144 | 1,155 | |
| N/A | | AX2000-1CGS624M | Microchip Technology | IC FPGA 418 I/O 624CCGA | FPGAs | 624-CCGA (32.5x32.5) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 32256 Number of Logic Elements/Cells: 32256 | 567 | |
| N/A | | AX2000-1CQ256M | Microchip Technology | IC FPGA 136 I/O 256CQFP | FPGAs | 256-CQFP (75x75) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 32256 Number of Logic Elements/Cells: 32256 | 523 | |
| N/A | | AX2000-1CQ352M | Microchip Technology | IC FPGA 198 I/O 352CQFP | FPGAs | 352-CQFP (75x75) | 1.425 V - 1.575 V | -55°C – 125°C | Number of LABs/CLBs: 32256 Number of Logic Elements/Cells: 32256 | 1,156 | |