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Total Products: 13,051
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
XPC823CZT66B2T
XPC823CZT66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
433
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N/AN/AXPC823ECZT66BANXP SemiconductorsIC MPU 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
638
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XPC823EVR66B2
XPC823EVR66B2NXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
1,892
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QUOTE
XPC823EVR75B2
XPC823EVR75B2NXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
252
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QUOTE
N/AN/AXPC823EZT66BANXP SemiconductorsIC MPU 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
1,158
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QUOTE
N/AN/AXPC823EZT75BANXP SemiconductorsIC MPU 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
476
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QUOTE
XPC823ZT66B2T
XPC823ZT66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
199
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QUOTE
XPC823ZT75B2T
XPC823ZT75B2TNXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
88
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QUOTE
XPC823ZT81B2T
XPC823ZT81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
368
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QUOTE
XPC8240LVV200E
XPC8240LVV200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Additional Interfaces:
I2C, I²O, PCI, UART
613
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QUOTE
XPC8240LZU200E
XPC8240LZU200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)3.3V0°C – 105°C
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
954
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QUOTE
XPC8240RVV250E
XPC8240RVV250ENXP SemiconductorsIC MPU MPC82XX 250MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
250MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
Additional Interfaces:
I2C, I²O, PCI, UART
1,222
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QUOTE
XPC8240RZU250E
XPC8240RZU250ENXP SemiconductorsIC MPU MPC82XX 250MHZ 352TBGAMicroprocessors352-TBGA (35x35)3.3V0°C – 105°C
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
250MHz
Mounting Type:
Surface Mount
465
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QUOTE
XPC8260CVVIFBC
XPC8260CVVIFBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
854
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QUOTE
XPC8260CVVIHBC
XPC8260CVVIHBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
372
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QUOTE
XPC8260CZUHFBC
XPC8260CZUHFBCNXP SemiconductorsIC MPU MPC82XX 166MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
787
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QUOTE
XPC8260CZUIHBC
XPC8260CZUIHBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,165
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QUOTE
XPC8260VVHFBC
XPC8260VVHFBCNXP SemiconductorsIC MPU MPC82XX 166MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,480
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QUOTE
XPC8260VVIFBC
XPC8260VVIFBCNXP SemiconductorsIC MPU MPC82XX 200MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,139
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QUOTE
XPC8260ZUHFBC
XPC8260ZUHFBCNXP SemiconductorsIC MPU MPC82XX 166MHZ 480TBGAMicroprocessors480-TBGA (37.5x37.5)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
480-LBGA Exposed Pad
Supplier Device Package:
480-TBGA (37.5×37.5)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART
1,442
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QUOTE

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