 | | XC6SLX75-3FG484I | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 812 | |
 | | XC6SLX75-3FG676C | Advanced Micro Devices | IC FPGA 408 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 1,124 | |
 | | XC6SLX75-3FG676I | Advanced Micro Devices | IC FPGA 408 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 138 | |
 | | XC6SLX75-3FGG484C | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 1,326 | |
 | | XC6SLX75-3FGG484I | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 600 | |
 | | XC6SLX75-3FGG676C | Advanced Micro Devices | IC FPGA 408 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 387 | |
 | | XC6SLX75-3FGG676I | Advanced Micro Devices | IC FPGA 408 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 156 | |
 | | XC6SLX75-L1CSG484C | Advanced Micro Devices | IC FPGA 328 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 1,193 | |
 | | XC6SLX75-L1CSG484I | Advanced Micro Devices | IC FPGA 328 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 754 | |
 | | XC6SLX75-L1FG676I | Advanced Micro Devices | IC FPGA 408 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 887 | |
 | | XC6SLX75-L1FGG484C | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 409 | |
 | | XC6SLX75-L1FGG484I | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 1,365 | |
 | | XC6SLX75-N3CSG484C | Advanced Micro Devices | IC FPGA 328 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 1,301 | |
 | | XC6SLX75-N3CSG484I | Advanced Micro Devices | IC FPGA 328 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 211 | |
 | | XC6SLX75-N3FG484C | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 1,519 | |
 | | XC6SLX75-N3FG484I | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 383 | |
 | | XC6SLX75-N3FG676C | Advanced Micro Devices | IC FPGA 408 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 74637 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,428 | |
 | | XC6SLX75-N3FG676I | Advanced Micro Devices | IC FPGA 408 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 116 | |
 | | XC6SLX75-N3FGG484C | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 74637 | 1,372 | |
 | | XC6SLX75-N3FGG484I | Advanced Micro Devices | IC FPGA 280 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 74637 | 860 | |