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Total Products: 4,376
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC3S100E-4TQG144IXC3S100E-4TQG144IAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
100000
Number of I/O:
108
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Qualification:
N/A
Total RAM Bits:
73728
395
XC3S100E-4VQ100I
XC3S100E-4VQ100IAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Total RAM Bits:
73728
Number of I/O:
66
Number of Gates:
100000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
1,949
XC3S100E-4VQG100CXC3S100E-4VQG100CAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
66
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Qualification:
N/A
Total RAM Bits:
73728
1,373
XC3S100E-4VQG100I
XC3S100E-4VQG100IAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Total RAM Bits:
73728
Number of I/O:
66
Number of Gates:
100000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
1,023
N/AXC3S100E-5TQ144CAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
108
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Qualification:
N/A
Total RAM Bits:
73728
1,069
XC3S100E-5TQG144CXC3S100E-5TQG144CAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
100000
Number of I/O:
108
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Qualification:
N/A
Total RAM Bits:
73728
1,688
XC3S100E-5VQG100C
XC3S100E-5VQG100CAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Total RAM Bits:
73728
Number of I/O:
66
Number of Gates:
100000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
124
XC3S1200E-4FG320C
XC3S1200E-4FG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
250
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
345
XC3S1200E-4FG320IXC3S1200E-4FG320IAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
250
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
301
N/AXC3S1200E-4FG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
129
XC3S1200E-4FG400IXC3S1200E-4FG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
1,130
XC3S1200E-4FGG320C
XC3S1200E-4FGG320CAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
250
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
320-BGA
Supplier Device Package:
320-FBGA (19×19)
486
XC3S1200E-4FGG320IXC3S1200E-4FGG320IAdvanced Micro DevicesIC FPGA 250 I/O 320FBGAFPGAs320-FBGA (19x19)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
250
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
1,102
XC3S1200E-4FGG400C
XC3S1200E-4FGG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
304
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
2
XC3S1200E-4FGG400I
XC3S1200E-4FGG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
304
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
1,364
XC3S1200E-4FT256C
XC3S1200E-4FT256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
190
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,255
XC3S1200E-4FT256I
XC3S1200E-4FT256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
190
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,683
XC3S1200E-4FTG256C
XC3S1200E-4FTG256CAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
190
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
277
XC3S1200E-4FTG256IXC3S1200E-4FTG256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1200000
Number of I/O:
190
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
580
N/AXC3S1200E-5FG400CAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1200000
Number of I/O:
304
Number of LABs/CLBs:
2168
Number of Logic Elements/Cells:
19512
Qualification:
N/A
Total RAM Bits:
516096
1,126

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