 | | XC6SLX100-2CSG484C | Advanced Micro Devices | IC FPGA 338 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 649 | |
 | | XC6SLX100-2CSG484I | Advanced Micro Devices | IC FPGA 338 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 1,945 | |
 | | XC6SLX100-2FG484C | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 882 | |
 | | XC6SLX100-2FG484I | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 655 | |
 | | XC6SLX100-2FG676C | Advanced Micro Devices | IC FPGA 480 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 101261 | 1,022 | |
 | | XC6SLX100-2FG676I | Advanced Micro Devices | IC FPGA 480 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 101261 | 333 | |
 | | XC6SLX100-2FGG484C | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 136 | |
 | | XC6SLX100-2FGG484I | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 15 | |
 | | XC6SLX100-2FGG676C | Advanced Micro Devices | IC FPGA 480 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 80 | |
 | | XC6SLX100-2FGG676I | Advanced Micro Devices | IC FPGA 480 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 101261 | 956 | |
 | | XC6SLX100-3CSG484C | Advanced Micro Devices | IC FPGA 338 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 101261 | 699 | |
 | | XC6SLX100-3CSG484I | Advanced Micro Devices | IC FPGA 338 I/O 484CSBGA | FPGAs | 484-CSPBGA (19x19) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-FBGA, CSPBGA Supplier Device Package: 484-CSPBGA (19×19) | 675 | |
 | | XC6SLX100-3FG484C | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 101261 | 84 | |
 | | XC6SLX100-3FG484I | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 1,223 | |
 | | XC6SLX100-3FG676C | Advanced Micro Devices | IC FPGA 480 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 101261 | 39 | |
 | | XC6SLX100-3FG676I | Advanced Micro Devices | IC FPGA 480 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | -40°C – 100°C | Number of Logic Elements/Cells: 101261 | 127 | |
 | | XC6SLX100-3FGG484C | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 101261 | 215 | |
 | | XC6SLX100-3FGG484I | Advanced Micro Devices | IC FPGA 326 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 484-FBGA (23×23) | 1,601 | |
 | | XC6SLX100-3FGG676C | Advanced Micro Devices | IC FPGA 480 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14 V - 1.26 V | 0°C – 85°C | Number of Logic Elements/Cells: 101261 | 111 | |
 | | XC6SLX100-3FGG676I | Advanced Micro Devices | IC FPGA 480 I/O 676FBGA | FPGAs | 676-FBGA (27x27) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 101261 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 1,338 | |