| N/A | N/A | XCVU9P-2FLGA2104E | Advanced Micro Devices | IC FPGA 832 I/O 2104FCBGA | FPGAs | FLGA2104 | 825 mV - 876 mV | 0°C – 110°C | Number of LABs/CLBs: 1182240 Number of Logic Elements/Cells: 2586000 | 1,785 | |
| N/A | N/A | XCVU9P-2FLGA2104I | Advanced Micro Devices | IC FPGA 416 I/O 2104FCBGA | FPGAs | FLGA2104 | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 1182240 Number of Logic Elements/Cells: 2586000 | 396 | |
| N/A | | XCVU9P-2FLGA2577E | Advanced Micro Devices | IC FPGA 448 I/O 2577FCBGA | FPGAs | 2577-FCBGA (52.5x52.5) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2577-BBGA, FCBGA Supplier Device Package: 2577-FCBGA (52.5×52.5) | 1,499 | |
| N/A | | XCVU9P-2FLGA2577I | Advanced Micro Devices | IC FPGA 448 I/O 2577FCBGA | FPGAs | 2577-FCBGA (52.5x52.5) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2577-BBGA, FCBGA Supplier Device Package: 2577-FCBGA (52.5×52.5) | 1,132 | |
| N/A | N/A | XCVU9P-2FLGB2104E | Advanced Micro Devices | IC FPGA 702 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 825 mV - 876 mV | 0°C – 100°C | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 | 1,648 | |
| N/A | N/A | XCVU9P-2FLGB2104I | Advanced Micro Devices | IC FPGA 702 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 | 652 | |
| N/A | | XCVU9P-2FLGC2104E | Advanced Micro Devices | IC FPGA 416 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 1,385 | |
| N/A | | XCVU9P-2FLGC2104I | Advanced Micro Devices | IC FPGA 416 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 1,334 | |
| N/A | | XCVU9P-2FSGD2104E | Advanced Micro Devices | IC FPGA 676 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 671 | |
| N/A | N/A | XCVU9P-2FSGD2104I | Advanced Micro Devices | IC FPGA 676 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 | 954 | |
| N/A | N/A | XCVU9P-3FLGA2104E | Advanced Micro Devices | IC FPGA 832 I/O 2104FCBGA | FPGAs | FLGA2104 | 825 mV - 876 mV | 0°C – 110°C | Number of LABs/CLBs: 1182240 Number of Logic Elements/Cells: 2586000 | 322 | |
| N/A | N/A | XCVU9P-3FLGB2104E | Advanced Micro Devices | IC FPGA 702 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 873 mV - 927 mV | 0°C – 100°C | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 | 65 | |
| N/A | | XCVU9P-3FSGD2104E | Advanced Micro Devices | IC FPGA 676 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.873V ~ 0.927V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.873V ~ 0.927V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 1,586 | |
| N/A | | XCVU9P-L2FLGA2104E | Advanced Micro Devices | IC FPGA 832 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.698V ~ 0.742V | 0°C ~ 110°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 1,556 | |
| N/A | | XCVU9P-L2FLGA2577E | Advanced Micro Devices | IC FPGA 448 I/O 2577FCBGA | FPGAs | 2577-FCBGA (52.5x52.5) | 0.698V ~ 0.742V | 0°C ~ 110°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 2577-BBGA, FCBGA Supplier Device Package: 2577-FCBGA (52.5×52.5) | 854 | |
| N/A | | XCVU9P-L2FLGB2104E | Advanced Micro Devices | IC FPGA 702 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.698V ~ 0.742V | 0°C ~ 110°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 763 | |
| N/A | | XCVU9P-L2FLGC2104E | Advanced Micro Devices | IC FPGA 416 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.698V ~ 0.742V | 0°C ~ 110°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 400 | |
| N/A | | XCVU9P-L2FSGD2104E | Advanced Micro Devices | IC FPGA 676 I/O 2104FCBGA | FPGAs | 2104-FCBGA (47.5x47.5) | 0.698V ~ 0.742V | 0°C ~ 110°C (TJ) | Number of LABs/CLBs: 147780 Number of Logic Elements/Cells: 2586150 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 110°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5×47.5) | 817 | |
 | | XE160FU8F40RAAKXUMA1 | Infineon Technologies | IC MCU 16/32B 64KB FLASH 38TSSOP | Microcontrollers | PG-TSSOP-38-8 | N/A | -40°C ~ 125°C (TA) | Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TSSOP-38-8 Package / Case: 38-TFSOP (0.173″”, 4.40mm Width) | 540 | |
 | | XE160FU8F66RAAFXUMA1 | Infineon Technologies | IC MCU 16/32B 64KB FLASH 38TSSOP | Microcontrollers | PG-TSSOP-38-8 | N/A | -40°C ~ 85°C (TA) | Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TSSOP-38-8 Package / Case: 38-TFSOP (0.173″”, 4.40mm Width) | 206 | |