 | | 5SGSMD3H2F35I3LN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 180 | |
 | | 5SGSMD3H2F35I3N | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 1,664 | |
 | | 5SGSMD3H2F35I3WN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 637 | |
 | N/A | 5SGSMD3H3F35C2G | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 245 | |
 | | 5SGSMD3H3F35C2L | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,308 | |
 | | 5SGSMD3H3F35C2LG | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 330 | |
 | | 5SGSMD3H3F35C2LN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 451 | |
 | | 5SGSMD3H3F35C2N | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 430 | |
 | | 5SGSMD3H3F35C2WN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 236 | |
 | | 5SGSMD3H3F35C3G | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 23 | |
 | | 5SGSMD3H3F35C3N | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 788 | |
 | N/A | 5SGSMD3H3F35C3WN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 52 | |
 | N/A | 5SGSMD3H3F35C4G | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,060 | |
 | | 5SGSMD3H3F35C4N | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,019 | |
 | N/A | 5SGSMD3H3F35C4WN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 123 | |
 | | 5SGSMD3H3F35I3G | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 1,162 | |
 | | 5SGSMD3H3F35I3L | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 515 | |
 | | 5SGSMD3H3F35I3LG | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 503 | |
 | | 5SGSMD3H3F35I3LN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 1,742 | |
 | | 5SGSMD3H3F35I3N | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 776 | |