 | | 5SGSMD3H3F35I3WN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 19 | |
 | | 5SGSMD3H3F35I4G | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 788 | |
 | | 5SGSMD3H3F35I4N | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA (35×35) | 37 | |
 | | 5SGSMD3H3F35I4WN | Intel | IC FPGA 432 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 89000 Number of Logic Elements/Cells: 236000 | 666 | |
 | N/A | 5SGSMD4E1H29C1G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,380 | |
 | | 5SGSMD4E1H29C1N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 559 | |
 | N/A | 5SGSMD4E1H29C1WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,703 | |
 | | 5SGSMD4E1H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 335 | |
 | | 5SGSMD4E1H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,525 | |
 | | 5SGSMD4E1H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 814 | |
 | | 5SGSMD4E1H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,229 | |
 | | 5SGSMD4E1H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 344 | |
 | N/A | 5SGSMD4E1H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 495 | |
 | N/A | 5SGSMD4E1H29I2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 297 | |
 | | 5SGSMD4E1H29I2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 447 | |
 | N/A | 5SGSMD4E1H29I2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,389 | |
 | | 5SGSMD4E2H29C1G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 730 | |
 | | 5SGSMD4E2H29C1N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,181 | |
 | N/A | 5SGSMD4E2H29C1WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,296 | |
 | N/A | 5SGSMD4E2H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 195 | |