 | N/A | 5SGSMD4E2H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,662 | |
 | | 5SGSMD4E2H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 371 | |
 | | 5SGSMD4E2H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 765 | |
 | | 5SGSMD4E2H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,123 | |
 | | 5SGSMD4E2H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 100 | |
 | | 5SGSMD4E2H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 736 | |
 | N/A | 5SGSMD4E2H29C3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 61 | |
 | | 5SGSMD4E2H29C3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 488 | |
 | | 5SGSMD4E2H29C3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 956 | |
 | | 5SGSMD4E2H29I2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 593 | |
 | | 5SGSMD4E2H29I2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 796 | |
 | | 5SGSMD4E2H29I2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,164 | |
 | | 5SGSMD4E2H29I2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 446 | |
 | | 5SGSMD4E2H29I2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 50 | |
 | | 5SGSMD4E2H29I2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 870 mV - 930 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,647 | |
 | | 5SGSMD4E2H29I3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 566 | |
 | | 5SGSMD4E2H29I3L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,157 | |
 | | 5SGSMD4E2H29I3LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,432 | |
 | | 5SGSMD4E2H29I3LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,496 | |
 | | 5SGSMD4E2H29I3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,886 | |