 | N/A | 5SGSMD4E2H29I3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 269 | |
 | N/A | 5SGSMD4E3H29C2G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 19 | |
 | | 5SGSMD4E3H29C2L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 218 | |
 | N/A | 5SGSMD4E3H29C2LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 174 | |
 | | 5SGSMD4E3H29C2LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 911 | |
 | | 5SGSMD4E3H29C2N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,212 | |
 | N/A | 5SGSMD4E3H29C2WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,031 | |
 | N/A | 5SGSMD4E3H29C3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,101 | |
 | | 5SGSMD4E3H29C3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,867 | |
 | | 5SGSMD4E3H29C3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 542 | |
 | | 5SGSMD4E3H29C4G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 315 | |
 | | 5SGSMD4E3H29C4N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 537 | |
 | | 5SGSMD4E3H29C4WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,218 | |
 | | 5SGSMD4E3H29I3G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 939 | |
 | | 5SGSMD4E3H29I3L | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 1,675 | |
 | N/A | 5SGSMD4E3H29I3LG | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,168 | |
 | | 5SGSMD4E3H29I3LN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 104 | |
 | | 5SGSMD4E3H29I3N | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 65 | |
 | N/A | 5SGSMD4E3H29I3WN | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 780-BBGA, FCBGA Supplier Device Package: 780-HBGA (33×33) | 1,267 | |
 | | 5SGSMD4E3H29I4G | Intel | IC FPGA 360 I/O 780HBGA | FPGAs | 780-HBGA (33x33) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 135840 Number of Logic Elements/Cells: 360000 | 74 | |