Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP3C55F484C8
EP3C55F484C8IntelIC FPGA 327 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
327
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
647
EP3C55F484C8NEP3C55F484C8NIntelIC FPGA 327 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
469
EP3C55F484I7EP3C55F484I7IntelIC FPGA 327 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
123
EP3C55F484I7N
EP3C55F484I7NIntelIC FPGA 327 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
327
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FBGA (23×23)
908
EP3C55F780C6EP3C55F780C6IntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
377
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
286
EP3C55F780C6NEP3C55F780C6NIntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
377
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
210
EP3C55F780C7
EP3C55F780C7IntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
377
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
585
EP3C55F780C7NEP3C55F780C7NIntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
377
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
537
EP3C55F780C8EP3C55F780C8IntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
377
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
321
EP3C55F780C8NEP3C55F780C8NIntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
377
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
564
EP3C55F780I7
EP3C55F780I7IntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
377
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
897
EP3C55F780I7N
EP3C55F780I7NIntelIC FPGA 377 I/O 780FBGAFPGAs780-FBGA (29x29)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
377
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BGA
Supplier Device Package:
780-FBGA (29×29)
5
EP3C55U484C6EP3C55U484C6IntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
1,770
EP3C55U484C6NEP3C55U484C6NIntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
654
EP3C55U484C7
EP3C55U484C7IntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
327
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
1,614
EP3C55U484C7NEP3C55U484C7NIntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
1,181
EP3C55U484C8EP3C55U484C8IntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
368
EP3C55U484C8N
EP3C55U484C8NIntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
327
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
199
EP3C55U484I7EP3C55U484I7IntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
327
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Qualification:
N/A
Total RAM Bits:
2396160
283
EP3C55U484I7N
EP3C55U484I7NIntelIC FPGA 327 I/O 484UBGAFPGAs484-UBGA (19x19)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3491
Number of Logic Elements/Cells:
55856
Total RAM Bits:
2396160
Number of I/O:
327
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA
Supplier Device Package:
484-UBGA (19×19)
30

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