Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EQCO125X40C1T-I/8EX
EQCO125X40C1T-I/8EXMicrochip TechnologyIC DRIVER FULL 1/1 16QFNDrivers, Receivers, Transceivers16-QFN (4x4)1.25V-40°C ~ 85°C
Type:
Driver
Number of Drivers/Receivers:
1/1
Duplex:
Full
Data Rate:
12.5Gbps
Voltage – Supply:
1.25V
Operating Temperature:
-40°C ~ 85°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Package / Case:
16-VQFN Exposed Pad
Supplier Device Package:
16-QFN (4×4)
1,779
EQCO125X40C1TB-I/3DW
EQCO125X40C1TB-I/3DWMicrochip TechnologyIC TRANSCEIVER FULL 1/1 16QFNDrivers, Receivers, Transceivers16-QFN (4x4)1.25V-40°C ~ 85°C
Type:
Transceiver
Number of Drivers/Receivers:
1/1
Duplex:
Full
Data Rate:
12.5Gbps
Voltage – Supply:
1.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-VQFN Exposed Pad
Supplier Device Package:
16-QFN (4×4)
140
EQCO125X40C1TB-I/8EXN/AEQCO125X40C1TB-I/8EXMicrochip TechnologyIC TRANSCEIVER FULL 1/1 16QFNDrivers, Receivers, Transceivers16-QFN (4x4)1.25V-40°C ~ 85°C
Type:
Transceiver
Number of Drivers/Receivers:
1/1
Duplex:
Full
Data Rate:
12.5Gbps
Voltage – Supply:
1.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
16-VQFN Exposed Pad
Supplier Device Package:
16-QFN (4×4)
590
N/A
EQCO5X31C0-I/6NXMicrochip TechnologyIC DUAL CHAN SGL LANE 20VQFNDrivers, Receivers, Transceivers20-VQFN (4x4)1.14V ~ 1.26V-40°C ~ 85°C
Protocol:
USB 3.2
Data Rate:
5Gbps
Voltage – Supply:
1.14V ~ 1.26V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount, Wettable Flank
Package / Case:
20-VFQFN Exposed Pad
Supplier Device Package:
20-VQFN (4×4)
1,495
ET80960JS3316N/AET80960JS3316IntelIC MPU I960 33MHZ 132QFPMicroprocessors132-QFPN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-QFP
Supplier Device Package:
132-QFP
180
ET80960JT10016N/AET80960JT10016IntelIC MPU I960 100MHZ 132QFPMicroprocessors132-QFPN/A0°C ~ 100°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
132-QFP
Supplier Device Package:
132-QFP
1,057
N/A
EWIXP455BABIntelIC MPU IXP455 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
447
N/A
EWIXP455BACIntelIC MPU INTEL 400MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
1,108
N/A
EWIXP460BADIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
161
N/A
EWIXP460BAEIntelIC MPU IXP460 667MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP46x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Additional Interfaces:
I2C, PCI, SPI, SSP, UART, UTOPIA 2
889
EX128-FTQ100
EX128-FTQ100Microchip TechnologyIC FPGA 70 I/O 100TQFPFPGAs100-TQFP (14x14)2.3V ~ 2.7V0°C ~ 70°C (TA)
Number of Logic Elements/Cells:
256
Number of I/O:
70
Number of Gates:
6000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
100-LQFP
Supplier Device Package:
100-TQFP (14×14)
1,288
EX128-FTQ64N/AEX128-FTQ64Microchip TechnologyIC FPGA 46 I/O 64TQFPFPGAs64-TQFP (10x10)2.3 V - 2.7 V0°C – 70°C
Grade:
Commercial
Number of Gates:
6000
Number of I/O:
46
Number of LABs/CLBs:
128
Number of Logic Elements/Cells:
256
Qualification:
N/A
1,614
EX128-FTQG100N/AEX128-FTQG100Microchip TechnologyIC FPGA 70 I/O 100TQFPFPGAs100-TQFP (14x14)2.3 V - 2.7 V0°C – 70°C
Grade:
Commercial
Number of Gates:
6000
Number of I/O:
70
Number of LABs/CLBs:
128
Number of Logic Elements/Cells:
256
Qualification:
N/A
1,504
EX128-FTQG64
EX128-FTQG64Microchip TechnologyIC FPGA 46 I/O 64TQFPFPGAs64-TQFP (10x10)2.3V ~ 2.7V0°C ~ 70°C (TA)
Number of Logic Elements/Cells:
256
Number of I/O:
46
Number of Gates:
6000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
64-LQFP
Supplier Device Package:
64-TQFP (10×10)
412
EX128-PTQ100
EX128-PTQ100Microchip TechnologyIC FPGA 70 I/O 100TQFPFPGAs100-TQFP (14x14)2.3V ~ 2.7V0°C ~ 70°C (TA)
Number of Logic Elements/Cells:
256
Number of I/O:
70
Number of Gates:
6000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
100-LQFP
Supplier Device Package:
100-TQFP (14×14)
1,115
EX128-PTQ100IN/AEX128-PTQ100IMicrochip TechnologyIC FPGA 70 I/O 100TQFPFPGAs100-TQFP (14x14)2.3 V - 2.7 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
6000
Number of I/O:
70
Number of LABs/CLBs:
128
Number of Logic Elements/Cells:
256
Qualification:
N/A
174
EX128-PTQ64N/AEX128-PTQ64Microchip TechnologyIC FPGA 46 I/O 64TQFPFPGAs64-TQFP (10x10)2.3 V - 2.7 V0°C – 70°C
Grade:
Commercial
Number of Gates:
6000
Number of I/O:
46
Number of LABs/CLBs:
128
Number of Logic Elements/Cells:
256
Qualification:
N/A
159
EX128-PTQ64I
EX128-PTQ64IMicrochip TechnologyIC FPGA 46 I/O 64TQFPFPGAs64-TQFP (10x10)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Number of Logic Elements/Cells:
256
Number of I/O:
46
Number of Gates:
6000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
64-LQFP
Supplier Device Package:
64-TQFP (10×10)
1,735
EX128-PTQG100
EX128-PTQG100Microchip TechnologyIC FPGA 70 I/O 100TQFPFPGAs100-TQFP (14x14)2.3V ~ 2.7V0°C ~ 70°C (TA)
Number of Logic Elements/Cells:
256
Number of I/O:
70
Number of Gates:
6000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
100-LQFP
Supplier Device Package:
100-TQFP (14×14)
372
EX128-PTQG100I
EX128-PTQG100IMicrochip TechnologyIC FPGA 70 I/O 100TQFPFPGAs100-TQFP (14x14)2.3V ~ 2.7V-40°C ~ 85°C (TA)
Number of Logic Elements/Cells:
256
Number of I/O:
70
Number of Gates:
6000
Voltage – Supply:
2.3V ~ 2.7V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
100-LQFP
Supplier Device Package:
100-TQFP (14×14)
50

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