 | | 5SGXMB9R2H43I3LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 937 | |
 | | 5SGXMB9R2H43I3LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 963 | |
 | | 5SGXMB9R2H43I3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 472 | |
 | N/A | 5SGXMB9R3H43C2G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,025 | |
 | | 5SGXMB9R3H43C2LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 752 | |
 | | 5SGXMB9R3H43C2LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,547 | |
 | | 5SGXMB9R3H43C2N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 1,965 | |
 | N/A | 5SGXMB9R3H43C3G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,177 | |
 | | 5SGXMB9R3H43C3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 58 | |
 | N/A | 5SGXMB9R3H43C4G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,796 | |
 | | 5SGXMB9R3H43C4N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 747 | |
 | N/A | 5SGXMB9R3H43I3G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 552 | |
 | N/A | 5SGXMB9R3H43I3LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,008 | |
 | | 5SGXMB9R3H43I3LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 1,298 | |
 | | 5SGXMB9R3H43I3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 83 | |
 | N/A | 5SGXMB9R3H43I4G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 328 | |
 | | 5SGXMB9R3H43I4N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 575 | |
 | | 5SGXMBBR1H43C2G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 | 355 | |
 | N/A | 5SGXMBBR1H43C2LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 266 | |
 | | 5SGXMBBR1H43C2LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,249 | |