Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
A3PE3000-PQG208IA3PE3000-PQG208IMicrochip TechnologyIC FPGA 147 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
516096
Number of I/O:
147
Number of Gates:
3000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
81
N/AA3PE3000L-1FG324Microchip TechnologyIC FPGA 221 I/O 324FBGAFPGAs324-FBGA (19x19)1.14 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
3000000
Number of I/O:
221
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
N/A
Total RAM Bits:
516096
765
N/AA3PE3000L-1FG324IMicrochip TechnologyIC FPGA 221 I/O 324FBGAFPGAs324-FBGA (19x19)1.14 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
3000000
Number of I/O:
221
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
N/A
Total RAM Bits:
516096
447
A3PE3000L-1FG484A3PE3000L-1FG484Microchip TechnologyIC FPGA 341 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
516096
Number of I/O:
341
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
466
A3PE3000L-1FG484IA3PE3000L-1FG484IMicrochip TechnologyIC FPGA 341 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
3000000
Number of I/O:
341
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
N/A
Total RAM Bits:
516096
1,655
A3PE3000L-1FG484MA3PE3000L-1FG484MMicrochip TechnologyIC FPGA 341 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
3000000
Number of I/O:
341
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
MIL-STD-883
Total RAM Bits:
516096
524
N/AA3PE3000L-1FG896Microchip TechnologyIC FPGA 620 I/O 896FBGAFPGAs896-FBGA (31x31)1.14V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
516096
Number of I/O:
620
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
1,565
N/AA3PE3000L-1FG896IMicrochip TechnologyIC FPGA 620 I/O 896FBGAFPGAs896-FBGA (31x31)1.14V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
516096
Number of I/O:
620
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
608
N/AA3PE3000L-1FG896MMicrochip TechnologyIC FPGA 620 I/O 896FBGAFPGAs896-FBGA (31x31)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
516096
Number of I/O:
620
Number of Gates:
3000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
281
N/AA3PE3000L-1FGG324Microchip TechnologyIC FPGA 221 I/O 324FBGAFPGAs324-FBGA (19x19)1.14V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
516096
Number of I/O:
221
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
324-BGA
Supplier Device Package:
324-FBGA (19×19)
597
N/AA3PE3000L-1FGG324IMicrochip TechnologyIC FPGA 221 I/O 324FBGAFPGAs324-FBGA (19x19)1.14V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
516096
Number of I/O:
221
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
324-BGA
Supplier Device Package:
324-FBGA (19×19)
245
A3PE3000L-1FGG484A3PE3000L-1FGG484Microchip TechnologyIC FPGA 341 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
516096
Number of I/O:
341
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
653
A3PE3000L-1FGG484IA3PE3000L-1FGG484IMicrochip TechnologyIC FPGA 341 I/O 484FBGAFPGAs484-FPBGA (23x23)1.14V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
516096
Number of I/O:
341
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
402
A3PE3000L-1FGG484MA3PE3000L-1FGG484MMicrochip TechnologyIC FPGA 341 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
3000000
Number of I/O:
341
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
MIL-STD-883
Total RAM Bits:
516096
209
N/AA3PE3000L-1FGG896Microchip TechnologyIC FPGA 620 I/O 896FBGAFPGAs896-FBGA (31x31)1.14V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
516096
Number of I/O:
620
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
1,062
N/AA3PE3000L-1FGG896IMicrochip TechnologyIC FPGA 620 I/O 896FBGAFPGAs896-FBGA (31x31)1.14 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
3000000
Number of I/O:
620
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
N/A
Total RAM Bits:
516096
108
N/AA3PE3000L-1FGG896MMicrochip TechnologyIC FPGA 620 I/O 896FBGAFPGAs896-FBGA (31x31)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
516096
Number of I/O:
620
Number of Gates:
3000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
896-BGA
Supplier Device Package:
896-FBGA (31×31)
731
A3PE3000L-1PQ208A3PE3000L-1PQ208Microchip TechnologyIC FPGA 147 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
516096
Number of I/O:
147
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,228
A3PE3000L-1PQ208IA3PE3000L-1PQ208IMicrochip TechnologyIC FPGA 147 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
516096
Number of I/O:
147
Number of Gates:
3000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
123
A3PE3000L-1PQG208A3PE3000L-1PQG208Microchip TechnologyIC FPGA 147 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
3000000
Number of I/O:
147
Number of LABs/CLBs:
75264
Number of Logic Elements/Cells:
75264
Qualification:
N/A
Total RAM Bits:
516096
1,067

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up