Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC2S50-6PQ208CXC2S50-6PQ208CAdvanced Micro DevicesIC FPGA 140 I/O 208QFPFPGAs208-PQFP (28x28)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
140
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
32768
150
XC2S50-6PQG208CXC2S50-6PQG208CAdvanced Micro DevicesIC FPGA 140 I/O 208QFPFPGAs208-PQFP (28x28)2.375 V - 2.625 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
140
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
32768
44
XC2S50-6TQ144CXC2S50-6TQ144CAdvanced Micro DevicesIC FPGA 92 I/O 144TQFPFPGAs144-TQFP (20x20)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
92
Number of Gates:
50000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
12
XC2S50-6TQG144CXC2S50-6TQG144CAdvanced Micro DevicesIC FPGA 92 I/O 144TQFPFPGAs144-TQFP (20x20)2.375V ~ 2.625V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
92
Number of Gates:
50000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
746
XC2S50E-6PQ208CXC2S50E-6PQ208CAdvanced Micro DevicesIC FPGA 146 I/O 208QFPFPGAs208-PQFP (28x28)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
146
Number of Gates:
50000
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
690
XC2S50E-6PQ208IXC2S50E-6PQ208IAdvanced Micro DevicesIC FPGA 146 I/O 208QFPFPGAs208-PQFP (28x28)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
50000
Number of I/O:
146
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
32768
455
XC2S50E-6PQG208CXC2S50E-6PQG208CAdvanced Micro DevicesIC FPGA 146 I/O 208QFPFPGAs208-PQFP (28x28)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
146
Number of Gates:
50000
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,650
XC2S50E-6TQ144CXC2S50E-6TQ144CAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
102
Number of Gates:
50000
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
239
XC2S50E-6TQG144CXC2S50E-6TQG144CAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
102
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
32768
216
XC2S600E-6FG456QXC2S600E-6FG456QAdvanced Micro DevicesIC FPGA 329 I/O 456FBGAFPGAs456-FBGA (23x23)1.71 V - 1.89 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
600000
Number of I/O:
329
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
AEC-Q100
Total RAM Bits:
294912
1,994
XC2S600E-6FGG456CXC2S600E-6FGG456CAdvanced Micro DevicesIC FPGA 329 I/O 456FBGAFPGAs456-FBGA (23x23)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
329
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
294912
263
XC2V1000-4BG575IXC2V1000-4BG575IAdvanced Micro DevicesIC FPGA 328 I/O 575BGAFPGAs575-BGA (31x31)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1280
Total RAM Bits:
737280
Number of I/O:
328
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
575-BBGA
Supplier Device Package:
575-BGA (31×31)
745
XC2V1000-4BGG575CXC2V1000-4BGG575CAdvanced Micro DevicesIC FPGA 328 I/O 575BGAFPGAs575-BGA (31x31)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
328
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
11520
Qualification:
N/A
Total RAM Bits:
737280
679
XC2V1000-4BGG575IXC2V1000-4BGG575IAdvanced Micro DevicesIC FPGA 328 I/O 575BGAFPGAs575-BGA (31x31)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1280
Total RAM Bits:
737280
Number of I/O:
328
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
575-BBGA
Supplier Device Package:
575-BGA (31×31)
1,486
XC2V1000-4FF896IXC2V1000-4FF896IAdvanced Micro DevicesIC FPGA 432 I/O 896FCBGAFPGAs896-FCBGA (31x31)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1280
Total RAM Bits:
737280
Number of I/O:
432
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FCBGA (31×31)
495
XC2V1000-4FFG896CXC2V1000-4FFG896CAdvanced Micro DevicesIC FPGA 432 I/O 896FCBGAFPGAs896-FCBGA (31x31)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1280
Total RAM Bits:
737280
Number of I/O:
432
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FCBGA (31×31)
796
XC2V1000-4FFG896IXC2V1000-4FFG896IAdvanced Micro DevicesIC FPGA 432 I/O 896FCBGAFPGAs896-FCBGA (31x31)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1280
Total RAM Bits:
737280
Number of I/O:
432
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FCBGA (31×31)
753
XC2V1000-4FG256IXC2V1000-4FG256IAdvanced Micro DevicesIC FPGA 172 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
172
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
11520
Qualification:
N/A
Total RAM Bits:
737280
234
XC2V1000-4FG456IXC2V1000-4FG456IAdvanced Micro DevicesIC FPGA 324 I/O 456FBGAFPGAs456-FBGA (23x23)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1280
Total RAM Bits:
737280
Number of I/O:
324
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,144
XC2V1000-4FGG256CXC2V1000-4FGG256CAdvanced Micro DevicesIC FPGA 172 I/O 256FBGAFPGAs256-FBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
172
Number of LABs/CLBs:
1280
Number of Logic Elements/Cells:
11520
Qualification:
N/A
Total RAM Bits:
737280
1,513

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