Field Programmable Gate Array (FPGA)

Suntsu’s FPGA (field programmable gate array) catalog covers a broad range of programmable gate array devices for industrial, communications, defense, and embedded computing applications. Source standard and hard-to-find FPGA chips from leading manufacturers with confidence. Browse our in-stock catalog or contact our team to discuss your requirements.

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Total Products: 22,180
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XCKU5P-2SFVB784EN/AXCKU5P-2SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Qualification:
N/A
Total RAM Bits:
41984000
1,533
XCKU5P-2SFVB784IN/AXCKU5P-2SFVB784IAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Qualification:
N/A
Total RAM Bits:
41984000
937
XCKU5P-3FFVB676E
XCKU5P-3FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Total RAM Bits:
41984000
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
317
XCKU5P-3SFVB784EN/AXCKU5P-3SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)873 mV - 927 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
1,402
XCKU5P-L1FFVB676I
XCKU5P-L1FFVB676IAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.698V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Total RAM Bits:
41984000
Number of I/O:
280
Voltage – Supply:
0.698V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
84
XCKU5P-L1SFVB784IN/AXCKU5P-L1SFVB784IAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)698 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Qualification:
N/A
Total RAM Bits:
41984000
546
XCKU5P-L2FFVA676E
XCKU5P-L2FFVA676EAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.698V ~ 0.876V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Total RAM Bits:
41984000
Number of I/O:
256
Voltage – Supply:
0.698V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
834
XCKU5P-L2FFVB676EN/AXCKU5P-L2FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)698 mV - 876 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Qualification:
N/A
Total RAM Bits:
41984000
861
XCKU5P-L2FFVD900EN/AXCKU5P-L2FFVD900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)698 mV - 876 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Qualification:
N/A
Total RAM Bits:
41984000
795
XCKU5P-L2SFVB784EN/AXCKU5P-L2SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)698 mV - 876 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
27120
Number of Logic Elements/Cells:
474600
Qualification:
N/A
Total RAM Bits:
41984000
470
N/AN/AXCKU9P-1FFVE900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
34260
Number of Logic Elements/Cells:
599550
Qualification:
N/A
Total RAM Bits:
41881600
1,507
N/A
XCKU9P-1FFVE900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
34260
Number of Logic Elements/Cells:
599550
Total RAM Bits:
41881600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31×31)
792
N/AN/AXCKU9P-2FFVE900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
34260
Number of Logic Elements/Cells:
599550
Qualification:
N/A
Total RAM Bits:
41881600
1,210
N/A
XCKU9P-2FFVE900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
34260
Number of Logic Elements/Cells:
599550
Total RAM Bits:
41881600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31×31)
347
N/AN/AXCKU9P-L1FFVE900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)698 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
34260
Number of Logic Elements/Cells:
599550
Qualification:
N/A
Total RAM Bits:
41881600
1,521
XCS05-3PC84CXCS05-3PC84CAdvanced Micro DevicesIC FPGA 61 I/O 84PLCCFPGAs84-PLCC (29.31x29.31)4.75 V - 5.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5000
Number of I/O:
61
Number of LABs/CLBs:
100
Number of Logic Elements/Cells:
238
Qualification:
N/A
Total RAM Bits:
3200
769
XCS05-3VQ100C
XCS05-3VQ100CAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)4.75V ~ 5.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
100
Number of Logic Elements/Cells:
238
Total RAM Bits:
3200
Number of I/O:
77
Number of Gates:
5000
Voltage – Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
785
XCS05-3VQ100I
XCS05-3VQ100IAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)4.5V ~ 5.5V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
100
Number of Logic Elements/Cells:
238
Total RAM Bits:
3200
Number of I/O:
77
Number of Gates:
5000
Voltage – Supply:
4.5V ~ 5.5V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
831
XCS05-4PC84C
XCS05-4PC84CAdvanced Micro DevicesIC FPGA 61 I/O 84PLCCFPGAs84-PLCC (29.31x29.31)4.75V ~ 5.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
100
Number of Logic Elements/Cells:
238
Total RAM Bits:
3200
Number of I/O:
61
Number of Gates:
5000
Voltage – Supply:
4.75V ~ 5.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
84-LCC (J-Lead)
Supplier Device Package:
84-PLCC (29.31×29.31)
88
XCS05-4VQ100CXCS05-4VQ100CAdvanced Micro DevicesIC FPGA 77 I/O 100VQFPFPGAs100-VQFP (14x14)4.75 V - 5.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
5000
Number of I/O:
77
Number of LABs/CLBs:
100
Number of Logic Elements/Cells:
238
Qualification:
N/A
Total RAM Bits:
3200
466

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About Field Programmable Gate Arrays (FPGA)

A field programmable gate array is a reconfigurable integrated circuit that allows engineers to implement custom digital logic without the cost or lead time of an application-specific IC (ASIC). Unlike fixed-function logic devices, FPGAs can be programmed and reprogrammed after manufacturing, making them well-suited for designs with evolving requirements, rapid prototyping cycles, and low-to-mid volume production runs.

FPGAs process data through an array of configurable logic blocks (CLBs) connected by a programmable routing fabric. This architecture enables parallel processing of high-speed data streams, making FPGAs the preferred solution in digital signal processing, machine vision, radar systems, telecommunications infrastructure, and real-time control applications. They are widely deployed across industrial automation, aerospace and defense, medical imaging, and high-performance computing.

Suntsu carries FPGAs alongside a full range of integrated circuits, including complementary devices such as clock and timing ICs and memory that are commonly designed alongside FPGAs in complex digital systems.

Types of Field Programmable Gate Arrays We Offer

Low-Density FPGAs

Low-density FPGAs offer a cost-effective entry point for designs requiring moderate logic capacity, basic I/O expansion, or glue logic replacement. These devices are commonly used in industrial control, consumer electronics, and embedded systems where a microcontroller alone cannot meet the parallel processing or I/O demands of the application. Their flexibility allows for rapid prototyping in design to meet evolving requirements.

High-Density FPGAs

High-density FPGAs provide large logic cell counts, embedded DSP blocks, high-speed transceivers, and on-chip memory resources for compute-intensive applications. These are specified in communications infrastructure, defense electronics, and AI inference platforms where throughput and low latency are critical. They frequently work alongside interface ICs and drivers and transceivers in high-speed data path designs.

Industrial-Grade FPGAs

Industrial FPGA devices are rated for extended temperature ranges and long product lifecycles, making them appropriate for automation, energy management, and ruggedized equipment. These parts prioritize supply continuity and environmental reliability over peak performance density.

Hard-to-Find and Obsolete FPGAs

Suntsu specializes in sourcing discontinued and allocation-constrained FPGA components for legacy system maintenance and last-time-buy scenarios. Search by part number or manufacturer to check availability across our inventory database.

How to Choose the Right Field Programmable Gate Array

Selecting the correct FPGA requires evaluating both the logic architecture and the broader system context:

Logic capacity and resource requirements: Estimate the number of logic cells, DSP slices, block RAM, and I/O pins your design requires. Undersizing leads to routing congestion; oversizing increases cost and power draw unnecessarily.

I/O standard and interface compatibility: Confirm that the FPGA supports the required I/O voltage standards and high-speed serial protocols (PCIe, LVDS, SERDES) for your system interfaces. Pair with appropriate logic ICs or specialized ICs where signal conditioning is needed.

Power supply and management: FPGAs typically require multiple supply rails for core, I/O, and auxiliary logic. Ensure your power architecture can meet the sequencing and regulation requirements of the selected device.

Operating temperature and reliability grade: Industrial and defense applications require devices rated beyond the commercial 0°C to 85°C range. Verify the temperature grade and qualification level against your deployment environment.

Toolchain and vendor ecosystem: FPGA selection is closely tied to the development toolchain. Factor in familiarity with the vendor’s synthesis and place-and-route environment, IP core availability, and long-term product roadmap support before committing to a device family.

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If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























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