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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | XOMAP3525BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD RAM Controllers: LPDDR Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Voltage – I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 519 | ||
 | XOMAP3530BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD RAM Controllers: LPDDR Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Voltage – I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 1,021 | ||
| N/A | XOMAPL137AZKB3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 256BGA | Microprocessors | 256-BGA | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 1,374 | ||
 | XOMAPL137BZKB3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 758 | ||
 | XOMAPL137DZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 375MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 884 | ||
 | XOMAPL138ZCE | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (13×13) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 1,221 | ||
 | XOMAPL138ZWT | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100Mbps (1) SATA: SATA 3Gbps (1) USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Voltage – I/O: 1.8V, 3.3V Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Package / Case: 361-LFBGA Supplier Device Package: 361-NFBGA (16×16) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 52 | ||
 | XPC823CZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 965 | ||
| N/A | XPC823ECZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TJ) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 1,208 | ||
 | XPC823EVR66B2 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 736 | ||
 | XPC823EVR75B2 | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 75MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 733 | ||
| N/A | N/A | XPC823EZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TJ) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 97 | |
| N/A | XPC823EZT75BA | NXP Semiconductors | IC MPU 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TJ) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 75MHz Co-Processors/DSP: Communications; RISC CPM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 855 | ||
 | XPC823ZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 752 | ||
 | XPC823ZT75B2T | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 75MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 714 | ||
 | XPC823ZT81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 81MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 1,031 | ||
 | XPC8240LVV200E | NXP Semiconductors | IC MPU MPC82XX 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 779 | ||
 | XPC8240LZU200E | NXP Semiconductors | IC MPU MPC82XX 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | 3.3V | 0°C – 105°C | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Mounting Type: Surface Mount | 226 | ||
 | XPC8240RVV250E | NXP Semiconductors | IC MPU MPC82XX 250MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 250MHz RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 627 | ||
 | XPC8240RZU250E | NXP Semiconductors | IC MPU MPC82XX 250MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | 3.3V | 0°C – 105°C | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 250MHz Mounting Type: Surface Mount | 474 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks.
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