Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XOMAP3525BCBBXOMAP3525BCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
825
XOMAP3530BCBBXOMAP3530BCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
931
N/AXOMAPL137AZKB3Texas InstrumentsIC MPU OMAP-L1X 300MHZ 256BGAMicroprocessors256-BGAN/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA
Grade:
Commercial
1,621
XOMAPL137BZKB3XOMAPL137BZKB3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Commercial
1,398
XOMAPL137DZKBA3XOMAPL137DZKBA3Texas InstrumentsIC MPU OMAP-L1X 375MHZ 256BGAMicroprocessors256-BGA (17x17)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-BGA (17×17)
Grade:
Industrial
613
XOMAPL138ZCEXOMAPL138ZCETexas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (13x13)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (13×13)
Grade:
Commercial
775
XOMAPL138ZWTXOMAPL138ZWTTexas InstrumentsIC MPU OMAP-L1X 300MHZ 361NFBGAMicroprocessors361-NFBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Signal Processing; C674x, System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
SATA 3Gbps (1)
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Security Features:
Boot Security, Cryptography
Mounting Type:
Surface Mount
Package / Case:
361-LFBGA
Supplier Device Package:
361-NFBGA (16×16)
Grade:
Commercial
1,130
XPC823CZT66B2TXPC823CZT66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
675
N/AN/AXPC823ECZT66BANXP SemiconductorsIC MPU 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A-40°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
13
XPC823EVR66B2XPC823EVR66B2NXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
435
XPC823EVR75B2XPC823EVR75B2NXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
593
N/AN/AXPC823EZT66BANXP SemiconductorsIC MPU 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
1,164
N/AN/AXPC823EZT75BANXP SemiconductorsIC MPU 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TJ)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
568
XPC823ZT66B2TXPC823ZT66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
549
XPC823ZT75B2TXPC823ZT75B2TNXP SemiconductorsIC MPU MPC8XX 75MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
1,336
XPC823ZT81B2TXPC823ZT81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BGA
Supplier Device Package:
256-PBGA (23×23)
667
XPC8240LVV200EXPC8240LVV200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
587
XPC8240LZU200EXPC8240LZU200ENXP SemiconductorsIC MPU MPC82XX 200MHZ 352TBGAMicroprocessors352-TBGA (35x35)3.3V0°C – 105°C
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Mounting Type:
Surface Mount
1,137
XPC8240RVV250EXPC8240RVV250ENXP SemiconductorsIC MPU MPC82XX 250MHZ 352TBGAMicroprocessors352-TBGA (35x35)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
250MHz
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
352-LBGA
Supplier Device Package:
352-TBGA (35×35)
640
XPC8240RZU250EXPC8240RZU250ENXP SemiconductorsIC MPU MPC82XX 250MHZ 352TBGAMicroprocessors352-TBGA (35x35)3.3V0°C – 105°C
Core Processor:
PowerPC 603e
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
250MHz
Mounting Type:
Surface Mount
464

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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