Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.
Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | XPC8260CVVIFBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,356 | ||
 | XPC8260CVVIHBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 382 | ||
 | XPC8260CZUHFBC | NXP Semiconductors | IC MPU MPC82XX 166MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 129 | ||
 | XPC8260CZUIHBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,179 | ||
 | XPC8260VVHFBC | NXP Semiconductors | IC MPU MPC82XX 166MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,291 | ||
 | XPC8260VVIFBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,232 | ||
 | XPC8260ZUHFBC | NXP Semiconductors | IC MPU MPC82XX 166MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 166MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 347 | ||
 | XPC8260ZUIFBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 1,313 | ||
 | XPC8260ZUIHBC | NXP Semiconductors | IC MPU MPC82XX 200MHZ 480TBGA | Microprocessors | 480-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Ethernet: 10/100Mbps (3) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Supplier Device Package: 480-TBGA (37.5×37.5) | 165 | ||
 | XPC850CZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 304 | ||
 | XPC850DECVR50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23×23) | 750 | ||
 | XPC850DECZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 502 | ||
 | XPC850DEZT50BT | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 261 | ||
 | XPC850DEZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 872 | ||
 | XPC850DSLCZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 478 | ||
 | XPC850DSLZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 562 | ||
 | XPC850SRZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 941 | ||
 | XPC850ZT50BU | NXP Semiconductors | IC MPU MPC8XX 50MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (1) USB: USB 1.x (1) Voltage – I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 256-BGA Supplier Device Package: 256-PBGA (23×23) | 1,217 | ||
 | Z16C0110PSC | Zilog | IC MPU SCC 10MHZ 40DIP | Microprocessors | 40-PDIP | N/A | 0°C ~ 70°C (TA) | Core Processor: Z16C00 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 10MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 40-DIP (0.620″, 15.75mm) Supplier Device Package: 40-PDIP Grade: Commercial | 567 | ||
 | Z16C0110PSG | Zilog | IC MPU SCC 10MHZ 40DIP | Microprocessors | 40-PDIP | N/A | 0°C ~ 70°C (TA) | Core Processor: Z16C00 Number of Cores/Bus Width: 1 Core, 16-Bit Speed: 10MHz Graphics Acceleration: No Voltage – I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 40-DIP (0.620″, 15.75mm) Supplier Device Package: 40-PDIP Grade: Commercial | 218 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
We’ve Got You Covered!
If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.
