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Total Products: 22,180
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
XCKU19P-3FFVB2104E
XCKU19P-3FFVB2104EAdvanced Micro DevicesIC FPGA KINTEX UP 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)0.873V ~ 0.927V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Total RAM Bits:
63753421
Number of I/O:
540
Voltage – Supply:
0.873V ~ 0.927V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2104-BBGA, FCBGA
Supplier Device Package:
2104-FCBGA (47.5×47.5)
461
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XCKU19P-3FFVJ1760E
XCKU19P-3FFVJ1760EAdvanced Micro DevicesIC FPGA KINTEX UP 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)873 mV - 927 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
540
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Qualification:
N/A
Total RAM Bits:
63753421
1,659
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QUOTE
XCKU19P-L1FFVB2104I
XCKU19P-L1FFVB2104IAdvanced Micro DevicesIC FPGA KINTEX UP LP 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
540
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Qualification:
N/A
Total RAM Bits:
63753421
708
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QUOTE
XCKU19P-L1FFVJ1760I
XCKU19P-L1FFVJ1760IAdvanced Micro DevicesIC FPGA KINTEX UP LP 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)698 mV - 742 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
540
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Qualification:
N/A
Total RAM Bits:
63753421
1,124
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QUOTE
XCKU19P-L2FFVB2104E
XCKU19P-L2FFVB2104EAdvanced Micro DevicesIC FPGA KINTEX UP LP 2104FCBGAFPGAs2104-FCBGA (47.5x47.5)698 mV - 742 mV0°C – 110°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
540
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Qualification:
N/A
Total RAM Bits:
63753421
1,045
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QUOTE
XCKU19P-L2FFVJ1760E
XCKU19P-L2FFVJ1760EAdvanced Micro DevicesIC FPGA KINTEX UP LP 1760FCBGAFPGAs1760-FCBGA (42.5x42.5)0.698V ~ 0.742V0°C ~ 110°C (TJ)
Number of LABs/CLBs:
105300
Number of Logic Elements/Cells:
1842750
Total RAM Bits:
63753421
Number of I/O:
540
Voltage – Supply:
0.698V ~ 0.742V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 110°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5×42.5)
775
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XCKU3P-1FFVA676EN/AXCKU3P-1FFVA676EAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
256
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
76
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QUOTE
XCKU3P-1FFVB676E
XCKU3P-1FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
380
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QUOTE
XCKU3P-1FFVB676I
XCKU3P-1FFVB676IAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
777
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QUOTE
XCKU3P-1FFVD900EN/AXCKU3P-1FFVD900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
454
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QUOTE
XCKU3P-1FFVD900IN/AXCKU3P-1FFVD900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
1,101
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QUOTE
XCKU3P-1SFVB784E
XCKU3P-1SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
667
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QUOTE
XCKU3P-1SFVB784IN/AXCKU3P-1SFVB784IAdvanced Micro DevicesIC FPGA 256 I/O 784FCBGAFPGAs784-FCBGA (23x23)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
256
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
1,245
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QUOTE
XCKU3P-2FFVA676E
XCKU3P-2FFVA676EAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
256
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
620
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QUOTE
XCKU3P-2FFVA676IN/AXCKU3P-2FFVA676IAdvanced Micro DevicesIC FPGA 256 I/O 676FCBGAFPGAs676-FCBGA (27x27)825 mV - 876 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
256
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
1,220
GET A
QUOTE
XCKU3P-2FFVB676E
XCKU3P-2FFVB676EAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
725
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QUOTE
XCKU3P-2FFVB676I
XCKU3P-2FFVB676IAdvanced Micro DevicesIC FPGA 280 I/O 676FCBGAFPGAs676-FCBGA (27x27)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
280
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
325
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QUOTE
XCKU3P-2FFVD900EN/AXCKU3P-2FFVD900EAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)825 mV - 876 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
304
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Qualification:
N/A
Total RAM Bits:
31641600
467
GET A
QUOTE
XCKU3P-2FFVD900I
XCKU3P-2FFVD900IAdvanced Micro DevicesIC FPGA 304 I/O 900FCBGAFPGAs900-FCBGA (31x31)0.825V ~ 0.876V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31×31)
18
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QUOTE
XCKU3P-2SFVB784E
XCKU3P-2SFVB784EAdvanced Micro DevicesIC FPGA 304 I/O 784FCBGAFPGAs784-FCBGA (23x23)0.825V ~ 0.876V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
20340
Number of Logic Elements/Cells:
355950
Total RAM Bits:
31641600
Number of I/O:
304
Voltage – Supply:
0.825V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23×23)
161
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QUOTE

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