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Total Products: 22,180
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
XCV2000E-7BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
1,466
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QUOTE
N/A
XCV2000E-7BG560IAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
998
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N/A
XCV2000E-7FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
804
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1156-BBGA
Supplier Device Package:
1156-FBGA (35×35)
1,005
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QUOTE
N/A
XCV2000E-7FG1156IAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
804
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA
Supplier Device Package:
1156-FBGA (35×35)
1,370
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QUOTE
N/A
XCV2000E-7FG860CAdvanced Micro DevicesIC FPGA 660 I/O 860FBGAFPGAs860-FBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
660
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
860-BGA Exposed Pad
Supplier Device Package:
860-FBGA (42.5×42.5)
780
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QUOTE
N/A
XCV2000E-8BG560CAdvanced Micro DevicesIC FPGA 404 I/O 560MBGAFPGAs560-MBGA (42.5x42.5)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
404
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
560-LBGA Exposed Pad, Metal
Supplier Device Package:
560-MBGA (42.5×42.5)
681
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QUOTE
N/A
XCV2000E-8FG1156CAdvanced Micro DevicesIC FPGA 804 I/O 1156FBGAFPGAs1156-FBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
2541952
Number of I/O:
804
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Qualification:
N/A
Total RAM Bits:
655360
832
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QUOTE
N/A
XCV2000E-8FG680CAdvanced Micro DevicesIC FPGA 512 I/O 680FTEBGAFPGAs680-FTEBGA (40x40)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
9600
Number of Logic Elements/Cells:
43200
Total RAM Bits:
655360
Number of I/O:
512
Number of Gates:
2541952
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
680-LBGA Exposed Pad
Supplier Device Package:
680-FTEBGA (40×40)
469
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N/A
XCV200E-6BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
306393
Number of I/O:
260
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
1,078
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QUOTE
XCV200E-6FG256C
XCV200E-6FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
306393
Number of I/O:
176
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
471
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QUOTE
XCV200E-6FG256I
XCV200E-6FG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
306393
Number of I/O:
176
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
57
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QUOTE
XCV200E-6FG456C
XCV200E-6FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)1.71V ~ 1.89V0°C – 85°C
Grade:
Commercial
Number of Gates:
306393
Number of I/O:
284
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
883
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QUOTE
XCV200E-6FG456I
XCV200E-6FG456IAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
306393
Number of I/O:
284
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
594
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QUOTE
N/A
XCV200E-6PQ240CAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
114688
Number of I/O:
158
Number of Gates:
306393
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
240-BFQFP
Supplier Device Package:
240-PQFP (32×32)
1,515
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QUOTE
N/A
XCV200E-6PQ240IAdvanced Micro DevicesIC FPGA 158 I/O 240QFPFPGAs240-PQFP (32x32)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
306393
Number of I/O:
158
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
240
GET A
QUOTE
N/A
XCV200E-7BG352CAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)1.71V ~ 1.89V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
114688
Number of I/O:
260
Number of Gates:
306393
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
352-LBGA Exposed Pad, Metal
Supplier Device Package:
352-MBGA (35×35)
575
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QUOTE
N/A
XCV200E-7BG352IAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
306393
Number of I/O:
260
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
1,108
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QUOTE
XCV200E-7FG256C
XCV200E-7FG256CAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
306393
Number of I/O:
176
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
1,420
GET A
QUOTE
XCV200E-7FG256I
XCV200E-7FG256IAdvanced Micro DevicesIC FPGA 176 I/O 256FBGAFPGAs256-FBGA (17x17)1.71 V - 1.89 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
306393
Number of I/O:
176
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
307
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QUOTE
XCV200E-7FG456C
XCV200E-7FG456CAdvanced Micro DevicesIC FPGA 284 I/O 456FBGAFPGAs456-FBGA (23x23)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
306393
Number of I/O:
284
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
N/A
Total RAM Bits:
114688
976
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QUOTE

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