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| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | 10M50DAF484C7G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 360 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23×23) | 389 | ||
 | 10M50DAF484C8G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 360 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23×23) | 1,780 | ||
 | 10M50DAF484I6G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 360 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23×23) | 1,621 | ||
 | 10M50DAF484I7G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15 V - 1.25 V | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: N/A Total RAM Bits: 1677312 | 595 | ||
 | 10M50DAF484I7P | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 360 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23×23) | 557 | ||
 | 10M50DAF672C6G | Intel | IC FPGA 500 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 500 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27×27) | 442 | ||
 | 10M50DAF672C6GES | Intel | IC FPGA 500 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.15 V - 1.25 V | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 500 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: N/A Total RAM Bits: 1677312 | 515 | ||
 | 10M50DAF672C7G | Intel | IC FPGA 500 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 500 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27×27) | 285 | ||
 | 10M50DAF672C8G | Intel | IC FPGA 500 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 500 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27×27) | 248 | ||
 | 10M50DAF672I6G | Intel | IC FPGA 500 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 500 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27×27) | 705 | ||
 | 10M50DAF672I7G | Intel | IC FPGA 500 I/O 672FBGA | FPGAs | 672-FBGA (27x27) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 500 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 672-BGA Supplier Device Package: 672-FBGA (27×27) | 195 | ||
 | 10M50DCF256A7G | Intel | IC FPGA 178 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.15 V - 1.25 V | -40°C – 125°C | Grade: Automotive Number of Gates: N/A Number of I/O: 178 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: AEC-Q100 Total RAM Bits: 1677312 | 1,685 | ||
 | 10M50DCF256C7G | Intel | IC FPGA 178 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.15 V - 1.25 V | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 178 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: N/A Total RAM Bits: 1677312 | 16 | ||
 | 10M50DCF256C8G | Intel | IC FPGA 178 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 178 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17×17) | 1,603 | ||
 | 10M50DCF256I6G | Intel | IC FPGA 178 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 178 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17×17) | 1,114 | ||
 | 10M50DCF256I7G | Intel | IC FPGA 178 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.15V ~ 1.25V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 178 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FBGA (17×17) | 642 | ||
 | 10M50DCF484C7G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15V ~ 1.25V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Total RAM Bits: 1677312 Number of I/O: 360 Voltage – Supply: 1.15V ~ 1.25V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BGA Supplier Device Package: 484-FBGA (23×23) | 693 | ||
 | 10M50DCF484C8G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15 V - 1.25 V | 0°C – 85°C | Grade: Commercial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: N/A Total RAM Bits: 1677312 | 772 | ||
 | 10M50DCF484I6G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15 V - 1.25 V | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: N/A Total RAM Bits: 1677312 | 606 | ||
 | 10M50DCF484I7G | Intel | IC FPGA 360 I/O 484FBGA | FPGAs | 484-FBGA (23x23) | 1.15 V - 1.25 V | -40°C – 100°C | Grade: Industrial Number of Gates: N/A Number of I/O: 360 Number of LABs/CLBs: 3125 Number of Logic Elements/Cells: 50000 Qualification: N/A Total RAM Bits: 1677312 | 1,030 |
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