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Total Products: 22,180
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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XC3S50AN-5FTG256C
XC3S50AN-5FTG256CAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Total RAM Bits:
55296
Number of I/O:
195
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,436
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XC3S50AN-5TQG144C
XC3S50AN-5TQG144CAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
50000
Number of I/O:
108
Number of LABs/CLBs:
176
Number of Logic Elements/Cells:
1584
Qualification:
N/A
Total RAM Bits:
55296
1,675
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QUOTE
XC3S700A-4FG400C
XC3S700A-4FG400CAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
311
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
1,693
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XC3S700A-4FG400I
XC3S700A-4FG400IAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
311
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
1,133
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XC3S700A-4FG484C
XC3S700A-4FG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,018
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XC3S700A-4FG484I
XC3S700A-4FG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
544
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XC3S700A-4FGG400C
XC3S700A-4FGG400CAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
311
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
1,064
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XC3S700A-4FGG400I
XC3S700A-4FGG400IAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
311
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
1,349
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QUOTE
XC3S700A-4FGG484C
XC3S700A-4FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
341
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QUOTE
XC3S700A-4FGG484I
XC3S700A-4FGG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,571
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XC3S700A-4FT256I
XC3S700A-4FT256IAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
161
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,053
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XC3S700A-4FTG256C
XC3S700A-4FTG256CAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
161
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
1,420
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XC3S700A-4FTG256I
XC3S700A-4FTG256IAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
161
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
967
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QUOTE
XC3S700A-5FGG400C
XC3S700A-5FGG400CAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
311
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
524
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XC3S700A-5FGG484C
XC3S700A-5FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
906
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QUOTE
XC3S700A-5FTG256C
XC3S700A-5FTG256CAdvanced Micro DevicesIC FPGA 161 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
161
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
18
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QUOTE
XC3S700AN-4FG484C
XC3S700AN-4FG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
340
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QUOTE
XC3S700AN-4FG484I
XC3S700AN-4FG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
1,553
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QUOTE
XC3S700AN-4FGG484C
XC3S700AN-4FGG484CAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
700000
Number of I/O:
372
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Qualification:
N/A
Total RAM Bits:
368640
1,273
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QUOTE
XC3S700AN-4FGG484I
XC3S700AN-4FGG484IAdvanced Micro DevicesIC FPGA 372 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1472
Number of Logic Elements/Cells:
13248
Total RAM Bits:
368640
Number of I/O:
372
Number of Gates:
700000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,709
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