 | | XCV300-5FG456I | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 64 | |
| N/A | | XCV300-5PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,319 | |
| N/A | | XCV300-5PQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,614 | |
| N/A | | XCV300-6BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 949 | |
| N/A | | XCV300-6BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,064 | |
 | | XCV300-6FG456C | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 494 | |
| N/A | | XCV300-6PQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,165 | |
| N/A | | XCV300E-6BG352C | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 352-LBGA Exposed Pad, Metal Supplier Device Package: 352-MBGA (35×35) | 1,579 | |
| N/A | | XCV300E-6BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 868 | |
| N/A | | XCV300E-6BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 272 | |
| N/A | | XCV300E-6BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 1,132 | |
 | | XCV300E-6FG256C | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 468 | |
 | | XCV300E-6FG256C0773 | Advanced Micro Devices | VIRTEX FPGA, 1536CLBS | FPGAs | 256-FBGA (17x17) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 6912 | 1,844 | |
 | | XCV300E-6FG256I | Advanced Micro Devices | IC FPGA 176 I/O 256FBGA | FPGAs | 256-FBGA (17x17) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FBGA (17×17) | 1,151 | |
 | | XCV300E-6FG456C | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 253 | |
 | | XCV300E-6FG456I | Advanced Micro Devices | IC FPGA 312 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 1,372 | |
| N/A | | XCV300E-6PQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 240-PQFP (32×32) | 1,292 | |
| N/A | | XCV300E-6PQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 1,362 | |
| N/A | | XCV300E-7BG352I | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 6912 | 1,354 | |
| N/A | | XCV300E-7BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 1,574 | |