 | | XCAU20P-2SFVB784I | Advanced Micro Devices | IC FPGA ARTIXUP 784FBGA | FPGAs | 784-FCBGA (23x23) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 13625 Number of Logic Elements/Cells: 238437 | 977 | |
 | | XCAU20P-L1FFVB676I | Advanced Micro Devices | IC FPGA ARTIX UP LP 676FCBGA | FPGAs | 676-FCBGA (27x27) | 698 mV - 742 mV | -40°C – 100°C | Number of LABs/CLBs: 13625 Number of Logic Elements/Cells: 238437 | 230 | |
 | | XCAU20P-L1SFVB784I | Advanced Micro Devices | IC FPGA ARTIX UP LP 784FCBGA | FPGAs | 784-FCBGA (23x23) | 698 mV - 742 mV | -40°C – 100°C | Number of LABs/CLBs: 13625 Number of Logic Elements/Cells: 238437 | 798 | |
 | | XCAU25P-1FFVB676E | Advanced Micro Devices | IC FPGA ARTIX UP 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 204 | |
 | | XCAU25P-1FFVB676I | Advanced Micro Devices | IC FPGA ARTIXUP 676FBGA | FPGAs | 676-FCBGA (27x27) | 0.825V ~ 0.876V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 377 | |
 | | XCAU25P-1SFVB784E | Advanced Micro Devices | IC FPGA ARTIX UP 784FCBGA | FPGAs | 784-FCBGA (23x23) | 0.825V ~ 0.876V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 Voltage – Supply: 0.825V ~ 0.876V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23×23) | 645 | |
 | | XCAU25P-1SFVB784I | Advanced Micro Devices | IC FPGA ARTIX UP 784FCBGA | FPGAs | 784-FCBGA (23x23) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 | 962 | |
 | | XCAU25P-2FFVB676E | Advanced Micro Devices | IC FPGA ARTIX UP 676FCBGA | FPGAs | 676-FCBGA (27x27) | 825 mV - 876 mV | 0°C – 100°C | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 | 953 | |
 | | XCAU25P-2FFVB676I | Advanced Micro Devices | IC FPGA ARTIX UP 676FCBGA | FPGAs | 676-FCBGA (27x27) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 | 597 | |
 | | XCAU25P-2SFVB784E | Advanced Micro Devices | IC FPGA ARTIX UP 784FCBGA | FPGAs | 784-FCBGA (23x23) | 825 mV - 876 mV | 0°C – 100°C | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 | 963 | |
 | | XCAU25P-2SFVB784I | Advanced Micro Devices | IC FPGA ARTIXUP 784FBGA | FPGAs | 784-FCBGA (23x23) | 825 mV - 876 mV | -40°C – 100°C | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 | 1,264 | |
 | | XCAU25P-L1FFVB676I | Advanced Micro Devices | IC FPGA ARTIX UP LP 676FCBGA | FPGAs | 676-FCBGA (27x27) | 698 mV - 742 mV | -40°C – 100°C | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 | 182 | |
 | | XCAU25P-L1SFVB784I | Advanced Micro Devices | IC FPGA ARTIX UP LP 784FCBGA | FPGAs | 784-FCBGA (23x23) | 0.698V ~ 0.742V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 17625 Number of Logic Elements/Cells: 308437 Voltage – Supply: 0.698V ~ 0.742V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCBGA Supplier Device Package: 784-FCBGA (23×23) | 1,105 | |
 | N/A | XCC2652RSIPMOTR | Texas Instruments | SIMPLELINK MULTIPROTOCOL 2.4-GHZ | RF Transceiver ICs | 73-QFM (7x7) | 1.8V ~ 3.8V | -40°C ~ 105°C (TJ) | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.2, Thread, Zigbee® Modulation: 4-FSK, 4-GFSK, DSSS, FSK, GFSK, MSK, O-QPSK Frequency: 2.36GHz ~ 2.5GHz Memory Size: 352kB Flash, 80kB RAM Serial Interfaces: ADC, GPIO, I2C, I2S, SPI, UART Voltage – Supply: 1.8V ~ 3.8V Current – Receiving: 7.3mA Current – Transmitting: 7.9mA ~ 10.9mA Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 73-SMD Module Supplier Device Package: 73-QFM (7×7) | 227 | |
| N/A | N/A | XCC2662R1FTWRGZRQ1 | Texas Instruments | AUTOMOTIVE QUALIFIED SIMPLELINK | RF Transceiver ICs | 48-VQFN (7x7) | 1.8V ~ 3.63V | -40°C ~ 105°C (TA) | Memory Size: 352kB Flash, 80kB RAM Serial Interfaces: ADC, GPIO, I2C, I2S, SPI, UART Voltage – Supply: 1.8V ~ 3.63V Current – Receiving: 6.9mA Current – Transmitting: 7mA ~ 9.2mA Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-VQFN (7×7) | 472 | |
| N/A | | XCDAISY-FF1924 | Advanced Micro Devices | IC FPGA | FPGAs | N/A | N/A | N/A | Number of Logic Elements/Cells: N/A | 1,357 | |
 | | XCKU025-1FFVA1156C | Advanced Micro Devices | IC FPGA 312 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 0.922V ~ 0.979V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 18180 Number of Logic Elements/Cells: 318150 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35×35) | 1,181 | |
 | | XCKU025-1FFVA1156I | Advanced Micro Devices | IC FPGA 312 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 18180 Number of Logic Elements/Cells: 318150 | 438 | |
 | | XCKU025-2FFVA1156E | Advanced Micro Devices | IC FPGA 312 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 0.922V ~ 0.979V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 18180 Number of Logic Elements/Cells: 318150 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35×35) | 827 | |
 | | XCKU025-2FFVA1156I | Advanced Micro Devices | IC FPGA 312 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 0.922V ~ 0.979V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 18180 Number of Logic Elements/Cells: 318150 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35×35) | 1,006 | |