 | | XCKU035-L1FBVA676I | Advanced Micro Devices | IC FPGA 312 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.880V ~ 0.979V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 25391 Number of Logic Elements/Cells: 444343 Voltage – Supply: 0.880V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 849 | |
 | | XCKU035-L1FBVA900I | Advanced Micro Devices | IC FPGA 468 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 880 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 25391 Number of Logic Elements/Cells: 444343 | 623 | |
 | | XCKU040-1FBVA676C | Advanced Micro Devices | IC FPGA 312 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 922 mV - 979 mV | 0°C – 85°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 452 | |
 | N/A | XCKU040-1FBVA676I | Advanced Micro Devices | IC FPGA 312 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 1,262 | |
 | | XCKU040-1FBVA900C | Advanced Micro Devices | IC FPGA 468 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 922 mV - 979 mV | 0°C – 85°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 1,425 | |
 | N/A | XCKU040-1FBVA900I | Advanced Micro Devices | IC FPGA 468 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 1,159 | |
 | | XCKU040-1FFVA1156C | Advanced Micro Devices | IC FPGA 520 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 922 mV - 979 mV | 0°C – 85°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 131 | |
 | | XCKU040-1FFVA1156I | Advanced Micro Devices | IC FPGA 520 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 934 | |
 | | XCKU040-1SFVA784C | Advanced Micro Devices | IC FPGA 468 I/O 784FCBGA | FPGAs | 784-FCCSPBGA (23x23) | 0.922V ~ 0.979V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 784-BFBGA, FCCSP Supplier Device Package: 784-FCCSPBGA (23×23) | 584 | |
 | | XCKU040-1SFVA784I | Advanced Micro Devices | IC FPGA 468 I/O 784FCBGA | FPGAs | 784-FCCSPBGA (23x23) | 0.922V ~ 0.979V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCCSP Supplier Device Package: 784-FCCSPBGA (23×23) | 540 | |
 | | XCKU040-2FBVA676E | Advanced Micro Devices | IC FPGA 312 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.922V ~ 0.979V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 580 | |
 | N/A | XCKU040-2FBVA676I | Advanced Micro Devices | IC FPGA 312 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 607 | |
 | | XCKU040-2FBVA900E | Advanced Micro Devices | IC FPGA 468 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 0.922V ~ 0.979V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31×31) | 202 | |
 | N/A | XCKU040-2FBVA900I | Advanced Micro Devices | IC FPGA 468 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 392 | |
 | | XCKU040-2FFVA1156E | Advanced Micro Devices | IC FPGA 520 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 922 mV - 979 mV | 0°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 798 | |
 | N/A | XCKU040-2FFVA1156I | Advanced Micro Devices | IC FPGA 520 I/O 1156FCBGA | FPGAs | 1156-FCBGA (35x35) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 412 | |
 | | XCKU040-2SFVA784E | Advanced Micro Devices | IC FPGA 468 I/O 784FCBGA | FPGAs | 784-FCCSPBGA (23x23) | 0.922V ~ 0.979V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.922V ~ 0.979V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BFBGA, FCCSP Supplier Device Package: 784-FCCSPBGA (23×23) | 1,062 | |
 | | XCKU040-2SFVA784I | Advanced Micro Devices | IC FPGA 468 I/O 784FCBGA | FPGAs | 784-FCCSPBGA (23x23) | 922 mV - 979 mV | -40°C – 100°C | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 | 834 | |
 | | XCKU040-3FBVA676E | Advanced Micro Devices | IC FPGA 312 I/O 676FCBGA | FPGAs | 676-FCBGA (27x27) | 0.970V ~ 1.030V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.970V ~ 1.030V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27×27) | 773 | |
 | | XCKU040-3FBVA900E | Advanced Micro Devices | IC FPGA 468 I/O 900FCBGA | FPGAs | 900-FCBGA (31x31) | 0.970V ~ 1.030V | 0°C ~ 100°C (TJ) | Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Voltage – Supply: 0.970V ~ 1.030V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31×31) | 1,331 | |