| N/A | | XCV600-4BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 1,574 | |
| N/A | | XCV600-4BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,652 | |
| N/A | | XCV600-4BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 15552 | 858 | |
 | | XCV600-4FG676C | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 1,613 | |
 | | XCV600-4FG676I | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 15552 | 907 | |
| N/A | | XCV600-4HQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 413 | |
| N/A | | XCV600-4HQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 1,203 | |
| N/A | | XCV600-5BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 219 | |
| N/A | | XCV600-5BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 1,084 | |
| N/A | | XCV600-5BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,426 | |
| N/A | | XCV600-5BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 974 | |
 | | XCV600-5FG676C | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 532 | |
 | | XCV600-5FG676I | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 15552 | 371 | |
| N/A | | XCV600-5FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 988 | |
| N/A | | XCV600-5FG680I | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 15552 | 1,702 | |
| N/A | | XCV600-5HQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 1,005 | |
| N/A | | XCV600-6BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 554 | |
| N/A | | XCV600-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 948 | |
 | | XCV600-6FG676C | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Supplier Device Package: 676-FBGA (27×27) | 74 | |
| N/A | | XCV600-6FG680C | Advanced Micro Devices | IC FPGA 512 I/O 680FTEBGA | FPGAs | 680-FTEBGA (40x40) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40×40) | 556 | |