| N/A | | XCV600E-7HQ240C | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 70 | |
| N/A | | XCV600E-7HQ240I | Advanced Micro Devices | IC FPGA 158 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 759 | |
| N/A | | XCV600E-8BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 1,214 | |
 | | XCV600E-8FG676C | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 1.71 V - 1.89 V | 0°C – 85°C | Number of Logic Elements/Cells: 15552 | 64 | |
| N/A | | XCV800-4BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 1,168 | |
| N/A | | XCV800-4BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 21168 | 1 | |
| N/A | | XCV800-4BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | 0°C ~ 85°C (TJ) | Number of Logic Elements/Cells: 21168 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 1,549 | |
| N/A | | XCV800-4BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 21168 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA Exposed Pad, Metal Supplier Device Package: 560-MBGA (42.5×42.5) | 195 | |
 | | XCV800-4FG676C | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 539 | |
| N/A | | XCV800-4HQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 21168 | 678 | |
| N/A | | XCV800-5BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 165 | |
| N/A | | XCV800-5BG432I | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 21168 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 918 | |
| N/A | | XCV800-5BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 1,702 | |
| N/A | | XCV800-5BG560I | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 21168 | 841 | |
 | | XCV800-5FG676C | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 308 | |
 | | XCV800-5FG676I | Advanced Micro Devices | IC FPGA 444 I/O 676FCBGA | FPGAs | 676-FBGA (27x27) | 2.375 V - 2.625 V | -40°C – 100°C | Number of Logic Elements/Cells: 21168 | 638 | |
| N/A | | XCV800-5HQ240C | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 820 | |
| N/A | | XCV800-5HQ240I | Advanced Micro Devices | IC FPGA 166 I/O 240QFP | FPGAs | 240-PQFP (32x32) | 2.375V ~ 2.625V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 21168 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32×32) | 202 | |
| N/A | | XCV800-6BG432C | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 334 | |
| N/A | | XCV800-6BG560C | Advanced Micro Devices | IC FPGA 404 I/O 560MBGA | FPGAs | 560-MBGA (42.5x42.5) | 2.375 V - 2.625 V | 0°C – 85°C | Number of Logic Elements/Cells: 21168 | 1,862 | |