Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP2S30F672I4
EP2S30F672I4IntelIC FPGA 500 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1694
Number of Logic Elements/Cells:
33880
Total RAM Bits:
1369728
Number of I/O:
500
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
222
EP2S30F672I4NEP2S30F672I4NAlteraIC FPGA 500 I/O 672FBGAFPGAs672-FBGA (27x27)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
500
Number of LABs/CLBs:
1694
Number of Logic Elements/Cells:
33880
Qualification:
N/A
Total RAM Bits:
1369728
494
EP2S60F1020C3
EP2S60F1020C3IntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
718
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
571
EP2S60F1020C3N
EP2S60F1020C3NIntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
718
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
342
EP2S60F1020C4
EP2S60F1020C4IntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
718
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
822
EP2S60F1020C4N
EP2S60F1020C4NIntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
718
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
1,203
EP2S60F1020C5EP2S60F1020C5IntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
718
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
816
EP2S60F1020C5N
EP2S60F1020C5NIntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
718
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
678
EP2S60F1020I4
EP2S60F1020I4IntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
718
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1020-BBGA
Supplier Device Package:
1020-FBGA (33×33)
129
EP2S60F1020I4NEP2S60F1020I4NIntelIC FPGA 718 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.15 V - 1.25 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
718
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
106
EP2S60F484C3EP2S60F484C3IntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
334
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
708
EP2S60F484C3N
EP2S60F484C3NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,541
EP2S60F484C4
EP2S60F484C4IntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
851
EP2S60F484C4N
EP2S60F484C4NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
445
EP2S60F484C5
EP2S60F484C5IntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
742
EP2S60F484C5N
EP2S60F484C5NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
775
EP2S60F484I4
EP2S60F484I4IntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,712
EP2S60F484I4N
EP2S60F484I4NIntelIC FPGA 334 I/O 484FBGAFPGAs484-FBGA (23x23)1.15V ~ 1.25V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
334
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,693
EP2S60F672C3
EP2S60F672C3IntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15V ~ 1.25V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Total RAM Bits:
2544192
Number of I/O:
492
Voltage – Supply:
1.15V ~ 1.25V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
672-BBGA
Supplier Device Package:
672-FBGA (27×27)
77
EP2S60F672C3NEP2S60F672C3NIntelIC FPGA 492 I/O 672FBGAFPGAs672-FBGA (27x27)1.15 V - 1.25 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
492
Number of LABs/CLBs:
3022
Number of Logic Elements/Cells:
60440
Qualification:
N/A
Total RAM Bits:
2544192
307

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