 | | 5SGXEB9R3H43C2L | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 506 | |
 | N/A | 5SGXEB9R3H43C2LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 708 | |
 | | 5SGXEB9R3H43C2LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 161 | |
 | | 5SGXEB9R3H43C2N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.87V ~ 0.93V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.87V ~ 0.93V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 188 | |
 | | 5SGXEB9R3H43C3G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 799 | |
 | | 5SGXEB9R3H43C3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,542 | |
 | N/A | 5SGXEB9R3H43C4G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 806 | |
 | | 5SGXEB9R3H43C4N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,824 | |
 | N/A | 5SGXEB9R3H43I3G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 15 | |
 | | 5SGXEB9R3H43I3L | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | -40°C – 100°C | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 | 1,495 | |
 | N/A | 5SGXEB9R3H43I3LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 955 | |
 | | 5SGXEB9R3H43I3LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 304 | |
 | | 5SGXEB9R3H43I3N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 759 | |
 | N/A | 5SGXEB9R3H43I4G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 858 | |
 | | 5SGXEB9R3H43I4N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 317000 Number of Logic Elements/Cells: 840000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 379 | |
 | | 5SGXEBBR1H43C2G | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 | 910 | |
 | | 5SGXEBBR1H43C2L | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 134 | |
 | N/A | 5SGXEBBR1H43C2LG | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 0.82V ~ 0.88V | 0°C ~ 85°C (TJ) | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 Voltage – Supply: 0.82V ~ 0.88V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-HBGA (45×45) | 1,373 | |
 | | 5SGXEBBR1H43C2LN | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 820 mV - 880 mV | 0°C – 85°C | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 | 1,349 | |
 | | 5SGXEBBR1H43C2N | Intel | IC FPGA 600 I/O 1760HBGA | FPGAs | 1760-HBGA (45x45) | 870 mV - 930 mV | 0°C – 85°C | Number of LABs/CLBs: 359200 Number of Logic Elements/Cells: 952000 | 637 | |