Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
A3P1000-FG484A3P1000-FG484Microchip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
147456
Number of I/O:
300
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
36
A3P1000-FG484IN/AA3P1000-FG484IMicrochip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
300
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
N/A
Total RAM Bits:
147456
743
A3P1000-FG484MA3P1000-FG484MMicrochip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
147456
Number of I/O:
300
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
740
A3P1000-FG484TA3P1000-FG484TMicrochip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1000000
Number of I/O:
300
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
AEC-Q100
Total RAM Bits:
147456
798
A3P1000-FGG144A3P1000-FGG144Microchip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
147456
Number of I/O:
97
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LBGA
Supplier Device Package:
144-FPBGA (13×13)
147
A3P1000-FGG144IA3P1000-FGG144IMicrochip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
147456
Number of I/O:
97
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
144-LBGA
Supplier Device Package:
144-FPBGA (13×13)
1,721
A3P1000-FGG144MA3P1000-FGG144MMicrochip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
1000000
Number of I/O:
97
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
MIL-STD-883
Total RAM Bits:
147456
689
A3P1000-FGG144TA3P1000-FGG144TMicrochip TechnologyIC FPGA 97 I/O 144FBGAFPGAs144-FPBGA (13x13)1.425 V - 1.575 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1000000
Number of I/O:
97
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
AEC-Q100
Total RAM Bits:
147456
474
A3P1000-FGG256N/AA3P1000-FGG256Microchip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
177
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
N/A
Total RAM Bits:
147456
631
A3P1000-FGG256IA3P1000-FGG256IMicrochip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
147456
Number of I/O:
177
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
894
A3P1000-FGG256MA3P1000-FGG256MMicrochip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.14V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
147456
Number of I/O:
177
Number of Gates:
1000000
Voltage – Supply:
1.14V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
1,133
A3P1000-FGG256TA3P1000-FGG256TMicrochip TechnologyIC FPGA 177 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V-40°C ~ 125°C (TA)
Total RAM Bits:
147456
Number of I/O:
177
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
407
A3P1000-FGG484N/AA3P1000-FGG484Microchip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
300
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
N/A
Total RAM Bits:
147456
379
A3P1000-FGG484IN/AA3P1000-FGG484IMicrochip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
1000000
Number of I/O:
300
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
N/A
Total RAM Bits:
147456
34
A3P1000-FGG484MA3P1000-FGG484MMicrochip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
147456
Number of I/O:
300
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
813
A3P1000-FGG484TA3P1000-FGG484TMicrochip TechnologyIC FPGA 300 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1000000
Number of I/O:
300
Number of LABs/CLBs:
24576
Number of Logic Elements/Cells:
24576
Qualification:
AEC-Q100
Total RAM Bits:
147456
745
A3P1000-PQ208A3P1000-PQ208Microchip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
147456
Number of I/O:
154
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
758
A3P1000-PQ208IA3P1000-PQ208IMicrochip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
147456
Number of I/O:
154
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
431
A3P1000-PQ208MA3P1000-PQ208MMicrochip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
147456
Number of I/O:
154
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
533
A3P1000-PQG208A3P1000-PQG208Microchip TechnologyIC FPGA 154 I/O 208QFPFPGAs208-PQFP (28x28)1.425V ~ 1.575V0°C ~ 85°C (TJ)
Total RAM Bits:
147456
Number of I/O:
154
Number of Gates:
1000000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
527

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