Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
A3PE600-FG484IA3PE600-FG484IMicrochip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
110592
Number of I/O:
270
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
1,108
A3PE600-FGG256A3PE600-FGG256Microchip TechnologyIC FPGA 165 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
165
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
110592
586
A3PE600-FGG256IA3PE600-FGG256IMicrochip TechnologyIC FPGA 165 I/O 256FBGAFPGAs256-FPBGA (17x17)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
110592
Number of I/O:
165
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
256-LBGA
Supplier Device Package:
256-FPBGA (17×17)
431
A3PE600-FGG484A3PE600-FGG484Microchip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
270
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
N/A
Total RAM Bits:
108000
1,148
A3PE600-FGG484IA3PE600-FGG484IMicrochip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Total RAM Bits:
110592
Number of I/O:
270
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
283
A3PE600L-1FG484MA3PE600L-1FG484MMicrochip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
600000
Number of I/O:
270
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
MIL-STD-883
Total RAM Bits:
110592
1,601
A3PE600L-1FGG484MA3PE600L-1FGG484MMicrochip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425 V - 1.575 V-55°C – 125°C
Grade:
Military
Number of Gates:
600000
Number of I/O:
270
Number of LABs/CLBs:
13824
Number of Logic Elements/Cells:
13824
Qualification:
MIL-STD-883
Total RAM Bits:
110592
444
A3PE600L-FG484MA3PE600L-FG484MMicrochip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
110592
Number of I/O:
270
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
39
A3PE600L-FGG484MA3PE600L-FGG484MMicrochip TechnologyIC FPGA 270 I/O 484FBGAFPGAs484-FPBGA (23x23)1.425V ~ 1.575V-55°C ~ 125°C (TJ)
Total RAM Bits:
110592
Number of I/O:
270
Number of Gates:
600000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
484-BGA
Supplier Device Package:
484-FPBGA (23×23)
663
A3PN010-1QNG48A3PN010-1QNG48Microchip TechnologyIC FPGA 34 I/O 48QFNFPGAs48-QFN (6x6)1.425 V - 1.575 V-20°C – 85°C
Grade:
Commercial
Number of Gates:
10000
Number of I/O:
34
Number of LABs/CLBs:
260
Number of Logic Elements/Cells:
260
Qualification:
N/A
397
A3PN010-1QNG48IA3PN010-1QNG48IMicrochip TechnologyIC FPGA 34 I/O 48QFNFPGAs48-QFN (6x6)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
10000
Number of I/O:
34
Number of LABs/CLBs:
260
Number of Logic Elements/Cells:
260
Qualification:
N/A
763
A3PN010-2QNG48A3PN010-2QNG48Microchip TechnologyIC FPGA 34 I/O 48QFNFPGAs48-QFN (6x6)1.425V ~ 1.575V-20°C ~ 85°C (TJ)
Number of I/O:
34
Number of Gates:
10000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-20°C ~ 85°C (TJ)
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-QFN (6×6)
992
A3PN010-2QNG48IA3PN010-2QNG48IMicrochip TechnologyIC FPGA 34 I/O 48QFNFPGAs48-QFN (6x6)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
10000
Number of I/O:
34
Number of LABs/CLBs:
260
Number of Logic Elements/Cells:
260
Qualification:
N/A
163
A3PN010-QNG48A3PN010-QNG48Microchip TechnologyIC FPGA 34 I/O 48QFNFPGAs48-QFN (6x6)1.425 V - 1.575 V-20°C – 85°C
Grade:
Commercial
Number of Gates:
10000
Number of I/O:
34
Number of LABs/CLBs:
260
Number of Logic Elements/Cells:
260
Qualification:
N/A
680
A3PN010-QNG48IA3PN010-QNG48IMicrochip TechnologyIC FPGA 34 I/O 48QFNFPGAs48-QFN (6x6)1.425V ~ 1.575V-40°C ~ 100°C (TJ)
Number of I/O:
34
Number of Gates:
10000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-QFN (6×6)
541
A3PN015-1QNG68A3PN015-1QNG68Microchip TechnologyIC FPGA 49 I/O 68QFNFPGAs68-QFN (8x8)1.425 V - 1.575 V-20°C – 85°C
Grade:
Commercial
Number of Gates:
15000
Number of I/O:
49
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
384
Qualification:
N/A
1,394
A3PN015-1QNG68IA3PN015-1QNG68IMicrochip TechnologyIC FPGA 49 I/O 68QFNFPGAs68-QFN (8x8)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
15000
Number of I/O:
49
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
384
Qualification:
N/A
7
A3PN015-2QNG68A3PN015-2QNG68Microchip TechnologyIC FPGA 49 I/O 68QFNFPGAs68-QFN (8x8)1.425 V - 1.575 V-20°C – 85°C
Grade:
Commercial
Number of Gates:
15000
Number of I/O:
49
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
384
Qualification:
N/A
958
A3PN015-2QNG68IA3PN015-2QNG68IMicrochip TechnologyIC FPGA 49 I/O 68QFNFPGAs68-QFN (8x8)1.425 V - 1.575 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
15000
Number of I/O:
49
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
384
Qualification:
N/A
83
A3PN015-QNG68A3PN015-QNG68Microchip TechnologyIC FPGA 49 I/O 68QFNFPGAs68-QFN (8x8)1.425V ~ 1.575V-20°C ~ 85°C (TJ)
Number of I/O:
49
Number of Gates:
15000
Voltage – Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
-20°C ~ 85°C (TJ)
Package / Case:
68-VFQFN Exposed Pad
Supplier Device Package:
68-QFN (8×8)
216

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