Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
10AX022E3F29E1HG
10AX022E3F29E1HGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
81
10AX022E3F29E1SG
10AX022E3F29E1SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
218
10AX022E3F29E2LG
10AX022E3F29E2LGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)0.87V ~ 0.93V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA, FC (29×29)
380
10AX022E3F29E2SG10AX022E3F29E2SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)870 mV - 930 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
288
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Qualification:
N/A
Total RAM Bits:
13752320
668
10AX022E3F29I1HG
10AX022E3F29I1HGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
334
10AX022E3F29I1SG10AX022E3F29I1SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
288
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Qualification:
N/A
Total RAM Bits:
13752320
1,203
10AX022E3F29I2LG10AX022E3F29I2LGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
288
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Qualification:
N/A
Total RAM Bits:
13752320
239
10AX022E3F29I2SG
10AX022E3F29I2SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)0.87V ~ 0.93V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA, FC (29×29)
1,531
10AX022E4F27E3LG
10AX022E4F27E3LGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA, FC (27x27)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA, FC (27×27)
182
10AX022E4F27E3SG10AX022E4F27E3SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA, FC (27x27)870 mV - 980 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Qualification:
N/A
Total RAM Bits:
13752320
1,356
10AX022E4F27I3LG10AX022E4F27I3LGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA, FC (27x27)870 mV - 980 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Qualification:
N/A
Total RAM Bits:
13752320
483
10AX022E4F27I3SG
10AX022E4F27I3SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA, FC (27x27)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA, FC (27×27)
547
10AX022E4F29E3LG
10AX022E4F29E3LGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA, FC (29×29)
325
10AX022E4F29E3SG10AX022E4F29E3SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)870 mV - 980 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
288
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Qualification:
N/A
Total RAM Bits:
13752320
1,029
10AX022E4F29I3LG
10AX022E4F29I3LGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA, FC (29×29)
248
10AX022E4F29I3SG
10AX022E4F29I3SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA, FC (29x29)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
80330
Number of Logic Elements/Cells:
220000
Total RAM Bits:
13752320
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA, FC (29×29)
1,515
10AX027E1F27E1HG
10AX027E1F27E1HGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
101620
Number of Logic Elements/Cells:
270000
Total RAM Bits:
17870848
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
441
10AX027E1F27E1SG
10AX027E1F27E1SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
101620
Number of Logic Elements/Cells:
270000
Total RAM Bits:
17870848
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
1,088
10AX027E1F27I1HG
10AX027E1F27I1HGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
101620
Number of Logic Elements/Cells:
270000
Total RAM Bits:
17870848
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
1,156
10AX027E1F27I1SG
10AX027E1F27I1SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
101620
Number of Logic Elements/Cells:
270000
Total RAM Bits:
17870848
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
272

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up