Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
10AX016E3F27E1HG
10AX016E3F27E1HGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.93V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
784
10AX016E3F27E1SG
10AX016E3F27E1SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.93V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
170
10AX016E3F27E2LG
10AX016E3F27E2LGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
732
10AX016E3F27E2SG
10AX016E3F27E2SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
241
10AX016E3F27I1HG10AX016E3F27I1HGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)870 mV - 980 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Qualification:
N/A
Total RAM Bits:
10086400
403
10AX016E3F27I1SG
10AX016E3F27I1SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
543
10AX016E3F27I2LG
10AX016E3F27I2LGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
1,831
10AX016E3F27I2SG
10AX016E3F27I2SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
403
10AX016E3F29E1HG
10AX016E3F29E1HGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
762
10AX016E3F29E1SG
10AX016E3F29E1SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.98V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
554
10AX016E3F29E2LG10AX016E3F29E2LGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)870 mV - 980 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
288
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Qualification:
N/A
Total RAM Bits:
10086400
796
10AX016E3F29E2SG10AX016E3F29E2SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)870 mV - 980 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
288
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Qualification:
N/A
Total RAM Bits:
10086400
819
10AX016E3F29I1HG
10AX016E3F29I1HGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
680
10AX016E3F29I1SG
10AX016E3F29I1SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
128
10AX016E3F29I2LG
10AX016E3F29I2LGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
302
10AX016E3F29I2SG
10AX016E3F29I2SGIntelIC FPGA 288 I/O 780FBGAFPGAs780-FBGA (29x29)0.87V ~ 0.98V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
288
Voltage – Supply:
0.87V ~ 0.98V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
780-BBGA, FCBGA
Supplier Device Package:
780-FBGA (29×29)
1,839
10AX016E4F27E3LG
10AX016E4F27E3LGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)0.87V ~ 0.93V0°C ~ 100°C (TJ)
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Total RAM Bits:
10086400
Number of I/O:
240
Voltage – Supply:
0.87V ~ 0.93V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
673
10AX016E4F27E3SG10AX016E4F27E3SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)870 mV - 930 mV0°C – 100°C
Grade:
Extended
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Qualification:
N/A
Total RAM Bits:
10086400
52
10AX016E4F27I3LG10AX016E4F27I3LGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Qualification:
N/A
Total RAM Bits:
10086400
1,011
10AX016E4F27I3SG10AX016E4F27I3SGIntelIC FPGA 240 I/O 672FBGAFPGAs672-FBGA (27x27)870 mV - 930 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
61510
Number of Logic Elements/Cells:
160000
Qualification:
N/A
Total RAM Bits:
10086400
78

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