Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XA2S100E-6TQ144IN/AXA2S100E-6TQ144IAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.71 V - 1.89 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
100000
Number of I/O:
102
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
AEC-Q100
Total RAM Bits:
40960
901
XA2S100E-6TQ144QN/AXA2S100E-6TQ144QAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.71 V - 1.89 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
100000
Number of I/O:
102
Number of LABs/CLBs:
600
Number of Logic Elements/Cells:
2700
Qualification:
AEC-Q100
Total RAM Bits:
40960
926
XA2S150E-6FT256IN/AXA2S150E-6FT256IAdvanced Micro DevicesIC FPGA 182 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.71 V - 1.89 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
150000
Number of I/O:
182
Number of LABs/CLBs:
864
Number of Logic Elements/Cells:
3888
Qualification:
AEC-Q100
Total RAM Bits:
49152
484
XA2S150E-6FT256QN/AXA2S150E-6FT256QAdvanced Micro DevicesIC FPGA 182 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.71 V - 1.89 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
150000
Number of I/O:
182
Number of LABs/CLBs:
864
Number of Logic Elements/Cells:
3888
Qualification:
AEC-Q100
Total RAM Bits:
49152
957
XA2S200E-6FT256IN/AXA2S200E-6FT256IAdvanced Micro DevicesIC FPGA 182 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.71 V - 1.89 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
200000
Number of I/O:
182
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Qualification:
AEC-Q100
Total RAM Bits:
57344
24
XA2S200E-6FT256QN/AXA2S200E-6FT256QAdvanced Micro DevicesIC FPGA 182 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.71V ~ 1.89V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
1176
Number of Logic Elements/Cells:
5292
Total RAM Bits:
57344
Number of I/O:
182
Number of Gates:
200000
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
449
XA2S300E-6FT256IN/AXA2S300E-6FT256IAdvanced Micro DevicesIC FPGA 182 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Total RAM Bits:
65536
Number of I/O:
182
Number of Gates:
300000
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
746
XA2S300E-6FT256QN/AXA2S300E-6FT256QAdvanced Micro DevicesIC FPGA 182 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.71 V - 1.89 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
300000
Number of I/O:
182
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
AEC-Q100
Total RAM Bits:
65536
397
XA2S50E-6TQ144IN/AXA2S50E-6TQ144IAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.71V ~ 1.89V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
32768
Number of I/O:
102
Number of Gates:
50000
Voltage – Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
773
XA2S50E-6TQ144QN/AXA2S50E-6TQ144QAdvanced Micro DevicesIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)1.71 V - 1.89 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
50000
Number of I/O:
102
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Qualification:
AEC-Q100
Total RAM Bits:
32768
569
XA3S1000-4FGG456IXA3S1000-4FGG456IAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1920
Number of Logic Elements/Cells:
17280
Total RAM Bits:
442368
Number of I/O:
333
Number of Gates:
1000000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
456-BBGA
Supplier Device Package:
456-FBGA (23×23)
1,320
XA3S1000-4FGG456QXA3S1000-4FGG456QAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1000000
Number of I/O:
333
Number of LABs/CLBs:
1920
Number of Logic Elements/Cells:
17280
Qualification:
AEC-Q100
Total RAM Bits:
442368
1,381
XA3S1000-4FTG256IXA3S1000-4FTG256IAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
1000000
Number of I/O:
173
Number of LABs/CLBs:
1920
Number of Logic Elements/Cells:
17280
Qualification:
AEC-Q100
Total RAM Bits:
442368
979
XA3S1000-4FTG256QXA3S1000-4FTG256QAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
1920
Number of Logic Elements/Cells:
17280
Total RAM Bits:
442368
Number of I/O:
173
Number of Gates:
1000000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,461
XA3S100E-4TQG144QXA3S100E-4TQG144QAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
100000
Number of I/O:
108
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Qualification:
AEC-Q100
Total RAM Bits:
73728
703
XA3S100E-4VQG100QXA3S100E-4VQG100QAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
240
Number of Logic Elements/Cells:
2160
Total RAM Bits:
73728
Number of I/O:
66
Number of Gates:
100000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
100-TQFP
Supplier Device Package:
100-VQFP (14×14)
249
XA3S1200E-4FGG400QXA3S1200E-4FGG400QAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
8672
Number of Logic Elements/Cells:
19512
Total RAM Bits:
516096
Number of I/O:
304
Number of Gates:
1200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
1,660
XA3S1200E-4FTG256QXA3S1200E-4FTG256QAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1200000
Number of I/O:
190
Number of LABs/CLBs:
8672
Number of Logic Elements/Cells:
19512
Qualification:
AEC-Q100
Total RAM Bits:
516096
1,562
XA3S1500-4FGG456IXA3S1500-4FGG456IAdvanced Micro DevicesIC FPGA 333 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
1500000
Number of I/O:
333
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Qualification:
AEC-Q100
Total RAM Bits:
589824
1,634
XA3S1500-4FGG676IXA3S1500-4FGG676IAdvanced Micro DevicesIC FPGA 487 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3328
Number of Logic Elements/Cells:
29952
Total RAM Bits:
589824
Number of I/O:
487
Number of Gates:
1500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
937

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