Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XA3S1600E-4FG400IXA3S1600E-4FG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
1600000
Number of I/O:
304
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
AEC-Q100
Total RAM Bits:
663552
241
XA3S1600E-4FGG400IXA3S1600E-4FGG400IAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
304
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
400-BGA
Supplier Device Package:
400-FBGA (21×21)
720
XA3S1600E-4FGG400QXA3S1600E-4FGG400QAdvanced Micro DevicesIC FPGA 304 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1600000
Number of I/O:
304
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
AEC-Q100
Total RAM Bits:
663552
1,428
XA3S1600E-4FGG484IXA3S1600E-4FGG484IAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
1600000
Number of I/O:
376
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Qualification:
AEC-Q100
Total RAM Bits:
663552
347
XA3S1600E-4FGG484QXA3S1600E-4FGG484QAdvanced Micro DevicesIC FPGA 376 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
3688
Number of Logic Elements/Cells:
33192
Total RAM Bits:
663552
Number of I/O:
376
Number of Gates:
1600000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,455
XA3S200-4PQG208IXA3S200-4PQG208IAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
200000
Number of I/O:
141
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Qualification:
AEC-Q100
Total RAM Bits:
221184
197
XA3S200-4PQG208QXA3S200-4PQG208QAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
200000
Number of I/O:
141
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Qualification:
AEC-Q100
Total RAM Bits:
221184
494
XA3S200-4TQG144IXA3S200-4TQG144IAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
200000
Number of I/O:
97
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Qualification:
AEC-Q100
Total RAM Bits:
221184
645
XA3S200-4TQG144QXA3S200-4TQG144QAdvanced Micro DevicesIC FPGA 97 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
200000
Number of I/O:
97
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Qualification:
AEC-Q100
Total RAM Bits:
221184
851
XA3S200A-4FTG256IXA3S200A-4FTG256IAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
448
Number of Logic Elements/Cells:
4032
Total RAM Bits:
294912
Number of I/O:
195
Number of Gates:
200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
980
XA3S200A-4FTG256QXA3S200A-4FTG256QAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
448
Number of Logic Elements/Cells:
4032
Total RAM Bits:
294912
Number of I/O:
195
Number of Gates:
200000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
893
XA3S250E-4CPG132QXA3S250E-4CPG132QAdvanced Micro DevicesIC FPGA 92 I/O 132CSBGAFPGAs132-CSPBGA (8x8)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
250000
Number of I/O:
92
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
AEC-Q100
Total RAM Bits:
221184
744
XA3S250E-4FTG256QXA3S250E-4FTG256QAdvanced Micro DevicesIC FPGA 172 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Total RAM Bits:
221184
Number of I/O:
172
Number of Gates:
250000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
230
XA3S250E-4PQG208IXA3S250E-4PQG208IAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
250000
Number of I/O:
158
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
AEC-Q100
Total RAM Bits:
221184
355
XA3S250E-4PQG208QXA3S250E-4PQG208QAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
250000
Number of I/O:
158
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
AEC-Q100
Total RAM Bits:
221184
24
XA3S250E-4TQG144QXA3S250E-4TQG144QAdvanced Micro DevicesIC FPGA 108 I/O 144TQFPFPGAs144-TQFP (20x20)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
250000
Number of I/O:
108
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
AEC-Q100
Total RAM Bits:
221184
187
XA3S250E-4VQG100IXA3S250E-4VQG100IAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
250000
Number of I/O:
66
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
AEC-Q100
Total RAM Bits:
221184
215
XA3S250E-4VQG100QXA3S250E-4VQG100QAdvanced Micro DevicesIC FPGA 66 I/O 100VQFPFPGAs100-VQFP (14x14)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
250000
Number of I/O:
66
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Qualification:
AEC-Q100
Total RAM Bits:
221184
1,896
XA3S400-4FGG456IXA3S400-4FGG456IAdvanced Micro DevicesIC FPGA 264 I/O 456FBGAFPGAs456-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
400000
Number of I/O:
264
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
AEC-Q100
Total RAM Bits:
294912
267
XA3S400-4FTG256QXA3S400-4FTG256QAdvanced Micro DevicesIC FPGA 173 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
173
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
1,792

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