Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XA3S400-4PQG208IXA3S400-4PQG208IAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
294912
Number of I/O:
141
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
394
XA3S400-4PQG208QXA3S400-4PQG208QAdvanced Micro DevicesIC FPGA 141 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
400000
Number of I/O:
141
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
AEC-Q100
Total RAM Bits:
294912
350
XA3S400A-4FGG400QXA3S400A-4FGG400QAdvanced Micro DevicesIC FPGA 311 I/O 400FBGAFPGAs400-FBGA (21x21)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
400000
Number of I/O:
311
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Qualification:
AEC-Q100
Total RAM Bits:
368640
1,252
XA3S400A-4FTG256IXA3S400A-4FTG256IAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
368640
Number of I/O:
195
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
535
XA3S400A-4FTG256QXA3S400A-4FTG256QAdvanced Micro DevicesIC FPGA 195 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
896
Number of Logic Elements/Cells:
8064
Total RAM Bits:
368640
Number of I/O:
195
Number of Gates:
400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
756
XA3S50-4PQG208IXA3S50-4PQG208IAdvanced Micro DevicesIC FPGA 124 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
50000
Number of I/O:
124
Number of LABs/CLBs:
192
Number of Logic Elements/Cells:
1728
Qualification:
AEC-Q100
Total RAM Bits:
73728
251
XA3S50-4PQG208QXA3S50-4PQG208QAdvanced Micro DevicesIC FPGA 124 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
192
Number of Logic Elements/Cells:
1728
Total RAM Bits:
73728
Number of I/O:
124
Number of Gates:
50000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
1,403
XA3S500E-4FT256QXA3S500E-4FT256QAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
190
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
213
XA3S500E-4FTG256IXA3S500E-4FTG256IAdvanced Micro DevicesIC FPGA 190 I/O 256FTBGAFPGAs256-FTBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
190
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
256-LBGA
Supplier Device Package:
256-FTBGA (17×17)
954
XA3S500E-4PQG208IXA3S500E-4PQG208IAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14 V - 1.26 V-40°C – 100°C
Grade:
Automotive
Number of Gates:
500000
Number of I/O:
158
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Qualification:
AEC-Q100
Total RAM Bits:
368640
901
XA3S500E-4PQG208QXA3S500E-4PQG208QAdvanced Micro DevicesIC FPGA 158 I/O 208QFPFPGAs208-PQFP (28x28)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
1164
Number of Logic Elements/Cells:
10476
Total RAM Bits:
368640
Number of I/O:
158
Number of Gates:
500000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
208-BFQFP
Supplier Device Package:
208-PQFP (28×28)
350
XA3SD1800A-4CSG484QXA3SD1800A-4CSG484QAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1800000
Number of I/O:
309
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
AEC-Q100
Total RAM Bits:
1548288
228
XA3SD1800A-4FGG676IXA3SD1800A-4FGG676IAdvanced Micro DevicesIC FPGA 519 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Total RAM Bits:
1548288
Number of I/O:
519
Number of Gates:
1800000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
760
XA3SD1800A-4FGG676QXA3SD1800A-4FGG676QAdvanced Micro DevicesIC FPGA 519 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
1800000
Number of I/O:
519
Number of LABs/CLBs:
4160
Number of Logic Elements/Cells:
37440
Qualification:
AEC-Q100
Total RAM Bits:
1548288
1,099
XA3SD3400A-4CSG484IXA3SD3400A-4CSG484IAdvanced Micro DevicesIC FPGA 309 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5968
Number of Logic Elements/Cells:
53712
Total RAM Bits:
2322432
Number of I/O:
309
Number of Gates:
3400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
300
XA3SD3400A-4FGG676IXA3SD3400A-4FGG676IAdvanced Micro DevicesIC FPGA 469 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5968
Number of Logic Elements/Cells:
53712
Total RAM Bits:
2322432
Number of I/O:
469
Number of Gates:
3400000
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
105
XA6SLX100-2FGG484IXA6SLX100-2FGG484IAdvanced Micro DevicesIC FPGA 326 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7911
Number of Logic Elements/Cells:
101261
Total RAM Bits:
4939776
Number of I/O:
326
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
1,158
XA6SLX100-2FGG484QXA6SLX100-2FGG484QAdvanced Micro DevicesIC FPGA 326 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 125°C (TJ)
Number of LABs/CLBs:
7911
Number of Logic Elements/Cells:
101261
Total RAM Bits:
4939776
Number of I/O:
326
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
278
XA6SLX16-2CSG225QXA6SLX16-2CSG225QAdvanced Micro DevicesIC FPGA 160 I/O 225CSBGAFPGAs225-CSPBGA (13x13)1.14 V - 1.26 V-40°C – 125°C
Grade:
Automotive
Number of Gates:
N/A
Number of I/O:
160
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Qualification:
AEC-Q100
Total RAM Bits:
589824
682
XA6SLX16-2CSG324IXA6SLX16-2CSG324IAdvanced Micro DevicesIC FPGA 232 I/O 324CSBGAFPGAs324-CSPBGA (15x15)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
1139
Number of Logic Elements/Cells:
14579
Total RAM Bits:
589824
Number of I/O:
232
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q100
Package / Case:
324-LFBGA, CSPBGA
Supplier Device Package:
324-CSPBGA (15×15)
996

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