Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AXC4VLX25-10FF668IAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
668-BBGA, FCBGA
Supplier Device Package:
668-FCBGA (27×27)
944
XC4VLX25-10FFG668CXC4VLX25-10FFG668CAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
268
N/AXC4VLX25-10FFG668IAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
1,258
XC4VLX25-10FFG676CXC4VLX25-10FFG676CAdvanced Micro DevicesIC FPGA 448 I/O 676FCBGAFPGAs676-FCBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
1,218
XC4VLX25-10FFG676IXC4VLX25-10FFG676IAdvanced Micro DevicesIC FPGA 448 I/O 676FCBGAFPGAs676-FCBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
382
N/AXC4VLX25-10SF363CAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
240
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
363-FBGA, FCBGA
Supplier Device Package:
363-FCBGA (17×17)
313
N/AXC4VLX25-10SF363IAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
240
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
363-FBGA, FCBGA
Supplier Device Package:
363-FCBGA (17×17)
385
XC4VLX25-10SFG363CXC4VLX25-10SFG363CAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
1,039
N/AXC4VLX25-10SFG363IAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
240
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
363-FBGA, FCBGA
Supplier Device Package:
363-FCBGA (17×17)
242
N/AXC4VLX25-11FF668CAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
668-BBGA, FCBGA
Supplier Device Package:
668-FCBGA (27×27)
387
N/AXC4VLX25-11FF668IAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
668-BBGA, FCBGA
Supplier Device Package:
668-FCBGA (27×27)
775
N/AXC4VLX25-11FFG668CAdvanced Micro DevicesIC 448 1327104 24192 668-BBGAFPGAs668-FCBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
253
N/AXC4VLX25-11FFG668IAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
557
XC4VLX25-11FFG676CXC4VLX25-11FFG676CAdvanced Micro DevicesIC FPGA 448 I/O 676FCBGAFPGAs676-FCBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
448
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27×27)
918
XC4VLX25-11FFG676IXC4VLX25-11FFG676IAdvanced Micro DevicesIC FPGA 448 I/O 676FCBGAFPGAs676-FCBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
1,583
N/AXC4VLX25-11SF363CAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
509
N/AXC4VLX25-11SF363IAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
345
XC4VLX25-11SFG363CXC4VLX25-11SFG363CAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
240
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
1,704
N/AXC4VLX25-11SFG363IAdvanced Micro DevicesIC FPGA 240 I/O 363FCBGAFPGAs363-FCBGA (17x17)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Total RAM Bits:
1327104
Number of I/O:
240
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
363-FBGA, FCBGA
Supplier Device Package:
363-FCBGA (17×17)
300
N/AXC4VLX25-12FF668CAdvanced Micro DevicesIC FPGA 448 I/O 668FCBGAFPGAs668-FCBGA (27x27)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
448
Number of LABs/CLBs:
2688
Number of Logic Elements/Cells:
24192
Qualification:
N/A
Total RAM Bits:
1327104
293

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