Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
XC6SLX75-3FGG484CXC6SLX75-3FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
866
XC6SLX75-3FGG484IXC6SLX75-3FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
146
XC6SLX75-3FGG676CXC6SLX75-3FGG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
802
XC6SLX75-3FGG676IXC6SLX75-3FGG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
408
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,878
XC6SLX75-L1CSG484CXC6SLX75-L1CSG484CAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
328
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
696
XC6SLX75-L1CSG484IXC6SLX75-L1CSG484IAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
328
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
443
XC6SLX75-L1FG676IXC6SLX75-L1FG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
474
XC6SLX75-L1FGG484CXC6SLX75-L1FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
253
XC6SLX75-L1FGG484IXC6SLX75-L1FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,243
XC6SLX75-N3CSG484CXC6SLX75-N3CSG484CAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
328
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
958
XC6SLX75-N3CSG484IXC6SLX75-N3CSG484IAdvanced Micro DevicesIC FPGA 328 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
328
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
968
XC6SLX75-N3FG484CXC6SLX75-N3FG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,310
XC6SLX75-N3FG484IXC6SLX75-N3FG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
237
XC6SLX75-N3FG676CXC6SLX75-N3FG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
1,129
XC6SLX75-N3FG676IXC6SLX75-N3FG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FCBGAFPGAs676-FBGA (27x27)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
408
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
847
XC6SLX75-N3FGG484CXC6SLX75-N3FGG484CAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
1,151
XC6SLX75-N3FGG484IXC6SLX75-N3FGG484IAdvanced Micro DevicesIC FPGA 280 I/O 484FBGAFPGAs484-FBGA (23x23)1.14 V - 1.26 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
280
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Qualification:
N/A
Total RAM Bits:
3170304
548
XC6SLX75-N3FGG676CXC6SLX75-N3FGG676CAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
273
XC6SLX75-N3FGG676IXC6SLX75-N3FGG676IAdvanced Micro DevicesIC FPGA 408 I/O 676FBGAFPGAs676-FBGA (27x27)1.14V ~ 1.26V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BGA
Supplier Device Package:
676-FBGA (27×27)
404
XC6SLX75T-2CSG484CXC6SLX75T-2CSG484CAdvanced Micro DevicesIC FPGA 292 I/O 484CSBGAFPGAs484-CSPBGA (19x19)1.14V ~ 1.26V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
292
Voltage – Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, CSPBGA
Supplier Device Package:
484-CSPBGA (19×19)
1,702

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